A transmission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior

Song Liu, Guangbao Shan, Chengmin Xie, Xinrong Du

doi: 10.1088/1674-4926/36/2/024009

key words: 3D IC, TSV, TSV electrical model, MOS effect, transmission line

An anisotropic thermal-stress model for through-silicon via

Song Liu, Guangbao Shan

doi: 10.1088/1674-4926/39/2/026003

key words: 3-D IC, through-silicon via, thermal-stress, TCAD simulation

Growth of large-scale two-dimensional insulator Na₂Ta₄O₁₁ through chemical vapor deposition

Yuanyuan Jin, Huimin Li, Song Liu

doi: 10.1088/1674-4926/41/7/072901

key words: Na₂Ta₄O₁₁, two-dimensional materials, chemical vapor deposition, insulator