• Call for Papers (Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications)


    Human body with curved and soft interface requests advanced flexible materials and structures for the interaction with organs and signal collection from targets in applications of e.g. bioengineering and diagnostic devices. Among them, it is highly demanded for creative design in flexible materials and structures with great stretchable capability for required applications. To meet such purpose, both inorganic and organic materials could be adopted and designed with assembly and self-assembly methods for flexible electronics and electrodes. Soft or flexible materials and structures inspired by nature can take the advantage of highly conformal contacts between devices and the human body. These approaches hold great potential for applications in flexible electronics, medical imaging technology and portable disease diagnostics. Novel strategy on related sensors/actuator and energy storage/generation devices could overcome certain limitation on flexible materials engineering and thus advance the field as well.

    This special issue is aiming at showcasing recent advances in all topics related to bioengineering, sensing, and energy applications with the special focus on flexible materials and their structures. We will accept both experimental and theoretical work. We invite submissions of original research articles/communications and comprehensive reviews to this special issue. Following topics are included to be covered in this special issue, but are not limited to:

    l Self-assembly and assembly of flexible materials and structures
    l Advanced semiconductor materials for flexible electronics
    l Bio-inspired soft materials and structures
    l Flexible material approaches for tissue engineering
    l Flexible materials and interface for new medical imaging technology
    l Portable disease diagnostic devices
    l Sensor and actuator
    l Energy storage and conversion


    Prof. Yongfeng Mei, Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, 200433 Shanghai, PR China.
    Group website: 

    Prof. Wei Gao, Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.
    Group web: 

    Prof. Hui Fang, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA.
    Group website:

    Prof. Yuan Lin, State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
    Group website:

    Prof. Guozhen Shen, Institute of Semiconductors, Chinese Academy of Sciences, PR China
    Group website: 

    Manuscript Submission:

    Manuscripts much be prepared according to Journal’s guidelines, available at .

    Submit your manuscripts directly to the listing guest editors via the e-mail addresses above. Or directly submit via the online submission address at 

    Please notify well in advance for your intension to submit a research paper.

    Key timetable dates:

    Manuscript due: September 31, 2020
    Authors’ notification: October 31, 2020
    Publication date: November 31, 2020



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