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A novel symmetrical microwave power sensor based on MEMS technology

Wang Debo and Liao Xiaoping

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Abstract: A novel symmetrical microwave power sensor based on MEMS technology is presented. In this power sensor, the left section inputs the microwave power, while the right section inputs the DC power. Because of its symmetrical structure, this power sensor provides more accurate microwave power measurement capability without mismatch uncertainty and temperature drift. The loss caused by the microwave signal is simulated in this power sensor. This power sensor is designed and fabricated using GaAs MMIC technology. And it is measured in the frequency range up to 20 GHz with an input power in the 0–80 mW range. Over the 80 mW dynamic range, the sensitivity can achieve about 0.2 mV/mW. The difference between the input power in the two sections is below 0.1% for an equal output voltage. In short, the key aspect of this power sensor is that the microwave power measurement is replaced with a DC power measurement.

Key words: symmetrical

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    Received: 18 August 2015 Revised: 25 November 2008 Online: Published: 01 May 2009

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      Wang Debo, Liao Xiaoping. A novel symmetrical microwave power sensor based on MEMS technology[J]. Journal of Semiconductors, 2009, 30(5): 054006. doi: 10.1088/1674-4926/30/5/054006 Wang D B, Liao X P. A novel symmetrical microwave power sensor based on MEMS technology[J]. J. Semicond., 2009, 30(5): 054006. doi: 10.1088/1674-4926/30/5/054006.Export: BibTex EndNote
      Citation:
      Wang Debo, Liao Xiaoping. A novel symmetrical microwave power sensor based on MEMS technology[J]. Journal of Semiconductors, 2009, 30(5): 054006. doi: 10.1088/1674-4926/30/5/054006

      Wang D B, Liao X P. A novel symmetrical microwave power sensor based on MEMS technology[J]. J. Semicond., 2009, 30(5): 054006. doi: 10.1088/1674-4926/30/5/054006.
      Export: BibTex EndNote

      A novel symmetrical microwave power sensor based on MEMS technology

      doi: 10.1088/1674-4926/30/5/054006
      • Received Date: 2015-08-18
      • Accepted Date: 2008-10-17
      • Revised Date: 2008-11-25
      • Published Date: 2009-04-20

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