SEMICONDUCTOR TECHNOLOGY

Wafer back pressure control and optimization in the CMP process

Men Yanwu, Zhang Hui, Zhou Kai and Ye Peiqing

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Abstract: Chemical mechanical polishing (CMP) is the most effective wafer global planarization technology. The CMP polishing head is one of the most important components, and zone back pressure control technology is used to design a new generation of polishing head. The quality of polishing not only depends on slurry, but also depends on the precise control of polishing pressures. During the CMP polishing process, the set pressure of each chamber is usually not the same and the presence of a flexible elastic diaphragm causes coupling effects. Because of the coupling effects, the identification of multi-chambers and pressure controls becomes complicated. To solve the coupling problem, this paper presents a new method of multi-chamber decoupled control, and then system identification and control parameter tuning are carried out based on the method. Finally, experiments of multi-chambers inflated at the same time are performed. The experimental results show that the presented decoupling control method is feasible and correct.

Key words: CMPzone pressure control technologydecoupling control解耦控制

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    Received: 20 August 2015 Revised: 10 October 2011 Online: Published: 01 December 2011

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      Men Yanwu, Zhang Hui, Zhou Kai, Ye Peiqing. Wafer back pressure control and optimization in the CMP process[J]. Journal of Semiconductors, 2011, 32(12): 126002. doi: 10.1088/1674-4926/32/12/126002 Men Y W, Zhang H, Zhou K, Ye P Q. Wafer back pressure control and optimization in the CMP process[J]. J. Semicond., 2011, 32(12): 126002. doi: 10.1088/1674-4926/32/12/126002.Export: BibTex EndNote
      Citation:
      Men Yanwu, Zhang Hui, Zhou Kai, Ye Peiqing. Wafer back pressure control and optimization in the CMP process[J]. Journal of Semiconductors, 2011, 32(12): 126002. doi: 10.1088/1674-4926/32/12/126002

      Men Y W, Zhang H, Zhou K, Ye P Q. Wafer back pressure control and optimization in the CMP process[J]. J. Semicond., 2011, 32(12): 126002. doi: 10.1088/1674-4926/32/12/126002.
      Export: BibTex EndNote

      Wafer back pressure control and optimization in the CMP process

      doi: 10.1088/1674-4926/32/12/126002
      Funds:

      the National Science Council of the People Republic of China (No.2008ZX02104)and the State Key Laboratory of Tribology provided funds (No.SKLT08B08)

      • Received Date: 2015-08-20
      • Accepted Date: 2011-08-05
      • Revised Date: 2011-10-10
      • Published Date: 2011-11-23

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