SEMICONDUCTOR MATERIALS

Effects of vacancy structural defects on the thermal conductivity of silicon thin films

Zhang Xingli and Sun Zhaowei

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Abstract: Vacancy structural defect effects on the lattice thermal conductivity of silicon thin films have been investigated with non-equilibrium molecular dynamics simulation. The lattice thermal conductivities decrease with increasing vacancy concentration at all temperatures from 300 to 700 K. Vacancy defects decrease the sample thermal conductivity, and the temperature dependence of thermal conductivity becomes less significant as the temperature increases. The molecular dynamics result is in good agreement with the theoretical analysis values obtained based on the Boltzmann equation. In addition, theoretical analysis indicates that the reduction in the lattice thermal conductivity with vacancy defects can be explained by the enhanced point-defect scattering due to lattice strain.

Key words: molecular dynamics simulationvacancy defectsthermal conductivitysilicon

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    Received: 18 August 2015 Revised: 09 December 2010 Online: Published: 01 May 2011

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      Zhang Xingli, Sun Zhaowei. Effects of vacancy structural defects on the thermal conductivity of silicon thin films[J]. Journal of Semiconductors, 2011, 32(5): 053002. doi: 10.1088/1674-4926/32/5/053002 Zhang X L, Sun Z W. Effects of vacancy structural defects on the thermal conductivity of silicon thin films[J]. J. Semicond., 2011, 32(5): 053002. doi: 10.1088/1674-4926/32/5/053002.Export: BibTex EndNote
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      Zhang Xingli, Sun Zhaowei. Effects of vacancy structural defects on the thermal conductivity of silicon thin films[J]. Journal of Semiconductors, 2011, 32(5): 053002. doi: 10.1088/1674-4926/32/5/053002

      Zhang X L, Sun Z W. Effects of vacancy structural defects on the thermal conductivity of silicon thin films[J]. J. Semicond., 2011, 32(5): 053002. doi: 10.1088/1674-4926/32/5/053002.
      Export: BibTex EndNote

      Effects of vacancy structural defects on the thermal conductivity of silicon thin films

      doi: 10.1088/1674-4926/32/5/053002
      • Received Date: 2015-08-18
      • Accepted Date: 2010-10-28
      • Revised Date: 2010-12-09
      • Published Date: 2011-04-21

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