SEMICONDUCTOR PHYSICS

Capacitance-voltage analysis of a high-k dielectric on silicon

Davinder Rathee, Sandeep K. Arya and Mukesh Kumar

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Abstract: Device characteristics of TiO2 gate dielectrics deposited by a sol-gel method and DC sputtering method on a P-type silicon wafer are reported. Metal-oxide-semiconductor capacitors with Al as the top electrode were fabricated to study the electrical properties of TiO2 films. The films were physically characterized by using X-ray diffraction, a capacitor voltage measurement, scanning electron microscopy, and by spectroscopy ellipsometry. The XRD and DST-TG indicate the presence of an anatase TiO2 phase in the film. Films deposited at higher temperatures showed better crystallinity. The dielectric constant calculated using the capacitance voltage measurement was found to be 18 and 73 for sputtering and sol-gel samples respectively. The refractive indices of the films were found to be 2.16 for sputtering and 2.42 for sol-gel samples.

Key words: solgel methodDC reactive sputteringC-V analysisflat band voltage

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    Received: 03 December 2014 Revised: 22 August 2011 Online: Published: 01 February 2012

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      Davinder Rathee, Sandeep K. Arya, Mukesh Kumar. Capacitance-voltage analysis of a high-k dielectric on silicon[J]. Journal of Semiconductors, 2012, 33(2): 022001. doi: 10.1088/1674-4926/33/2/022001 D Rathee, S K Arya, M Kumar. Capacitance-voltage analysis of a high-k dielectric on silicon[J]. J. Semicond., 2012, 33(2): 022001. doi:  10.1088/1674-4926/33/2/022001.Export: BibTex EndNote
      Citation:
      Davinder Rathee, Sandeep K. Arya, Mukesh Kumar. Capacitance-voltage analysis of a high-k dielectric on silicon[J]. Journal of Semiconductors, 2012, 33(2): 022001. doi: 10.1088/1674-4926/33/2/022001

      D Rathee, S K Arya, M Kumar. Capacitance-voltage analysis of a high-k dielectric on silicon[J]. J. Semicond., 2012, 33(2): 022001. doi:  10.1088/1674-4926/33/2/022001.
      Export: BibTex EndNote

      Capacitance-voltage analysis of a high-k dielectric on silicon

      doi: 10.1088/1674-4926/33/2/022001
      • Received Date: 2014-12-03
      • Accepted Date: 2011-07-07
      • Revised Date: 2011-08-22
      • Published Date: 2012-01-20

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