J. Semicond. > 2013, Volume 34 > Issue 5 > 053007, doi: 10.1088/1674-4926/34/5/053007
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SEMICONDUCTOR MATERIALS

Thermal analysis of remote phosphor in LED modules

Mingzhi Dong1, , Jia Wei2, Huaiyu Ye2, Cadmus Yuan3, 4 and Kouchi Zhang2

+ Author Affiliations

 Corresponding author: Dong Mingzhi,Email:mzdong85@gmail.com

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Abstract: Phosphor plays an important role in LED packages by converting the wavelength of light and achieving specific color. The property and degradation of phosphor are strongly affected by the temperature. Some structural factors have been investigated in this paper and their effects are evaluated. Remote phosphor is an effective approach to improve the performance and reliability of LED modules and products. It is a trade-off that the final product design depends on both the thermal performance and the cost.

Key words: LED module, remote phosphor, thermal management



[1]
Chang M H, Das D, Varde P V, et al. Light emitting diodes reliability review. Microelectron Reliab, 2012, 52:762 doi: 10.1016/j.microrel.2011.07.063
[2]
Narendran N, Gu Y, Freyssinier J P, et al. Solid-state lighting:failure analysis of white LEDs. J Cryst Growth, 2004, 268:449 doi: 10.1016/j.jcrysgro.2004.04.071
[3]
http://www.ecat.lighting.philips.com/l/lamps/led-lamps-and-systems/led-lamps/21063/cat/#, last accessed on Sept 26, 2012
Fig. 1.  Layout of LEDs within the module (not to scale).

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Fig. 2.  Cross-sectional view of the LED module (not to scale).

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Fig. 3.  A quarter of the whole 3-D model.

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Fig. 4.  Temperature distribution of LED module (pitch $=$ 1300 $\mu$m, silicone thickness $=$ 600 $\mu$m).

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Fig. 5.  LED and phosphor temperature with various pitches.

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Fig. 6.  LED and phosphor temperature with various silicone thicknesses.

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Table 1.   Dimensions of LED module.

Table 2.   Range of variables for simulation.

Table 3.   Properties of materials for simulation.
[1]
Chang M H, Das D, Varde P V, et al. Light emitting diodes reliability review. Microelectron Reliab, 2012, 52:762 doi: 10.1016/j.microrel.2011.07.063
[2]
Narendran N, Gu Y, Freyssinier J P, et al. Solid-state lighting:failure analysis of white LEDs. J Cryst Growth, 2004, 268:449 doi: 10.1016/j.jcrysgro.2004.04.071
[3]
http://www.ecat.lighting.philips.com/l/lamps/led-lamps-and-systems/led-lamps/21063/cat/#, last accessed on Sept 26, 2012

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    Received: 27 November 2012 Revised: Online: Published: 01 May 2013

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      Article Navigation >  Journal of Semiconductors  > 2013  >  34(5): 053007
      Mingzhi Dong, Jia Wei, Huaiyu Ye, Cadmus Yuan, Kouchi Zhang. Thermal analysis of remote phosphor in LED modules[J]. Journal of Semiconductors, 2013, 34(5): 053007. doi: 10.1088/1674-4926/34/5/053007 M Z Dong, J Wei, H Y Ye, C Yuan, K C Zhang. Thermal analysis of remote phosphor in LED modules[J]. J. Semicond., 2013, 34(5): 053007. doi: 10.1088/1674-4926/34/5/053007.Export: BibTex EndNote
      Citation:
      Mingzhi Dong, Jia Wei, Huaiyu Ye, Cadmus Yuan, Kouchi Zhang. Thermal analysis of remote phosphor in LED modules[J]. Journal of Semiconductors, 2013, 34(5): 053007. doi: 10.1088/1674-4926/34/5/053007

      M Z Dong, J Wei, H Y Ye, C Yuan, K C Zhang. Thermal analysis of remote phosphor in LED modules[J]. J. Semicond., 2013, 34(5): 053007. doi: 10.1088/1674-4926/34/5/053007.
      Export: BibTex EndNote
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      Thermal analysis of remote phosphor in LED modules

      doi: 10.1088/1674-4926/34/5/053007
      • 1.

        Beijing Research Centre, Delft University of Technology, Beijing 100083, China

      • 2.

        DIMES, Delft University of Technology, Feldmannweg 17, 2628 CT, Delft, the Netherlands

      • 3.

        State Key Laboratory of Solid State Lighting, Beijing 100083, China

      • 4.

        Research and Development Center for Semiconductor Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

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      • Corresponding author: Dong Mingzhi,Email:mzdong85@gmail.com
      • Received Date: 2012-11-27
      • Published Date: 2013-05-01

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