SEMICONDUCTOR DEVICES

Ceramic thermal wind sensor based on advanced direct chip attach package

Lin Zhou, Ming Qin, Shengqi Chen and Bei Chen

+ Author Affiliations

 Corresponding author: Qin Ming, Email:mqin@seu.edu.cn

PDF

Abstract: An advanced direct chip attach packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attach (DCA) packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics (CFD) model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.

Key words: advanced direct chip attach packageCFD modelceramic chipthermal wind sensor



[1]
Huang Jinbao, Li Bin, Tong Qinyi, et al. A fully integrated flow sensor. Chinese Journal of Semiconductors, 1989, 10(1): 55(in Chinese) https://www.ama-science.org/proceedings/details/411
[2]
Van Oudheusden B W. Silicon thermal flow sensor with a two-dimensional direction sensitivity. Measurement Science and Technology, 1990, 1(7): 565 doi: 10.1088/0957-0233/1/7/005
[3]
Huang Jinbiao, Luo Zhiqiang, Feng Yaolan, et al. Flow velocity sensor fabricated by surface micromaching technology. Chinese Journal of Semiconductors, 1993, 14(7): 450(in Chinese)
[4]
Matova S P, Makinwa Kofi A A, Huijsing J H. Compensation of packaging asymmetry in a 2-D wind sensor. IEEE Sensor J, 2003, 3(6): 761 doi: 10.1109/JSEN.2003.820324
[5]
Gao Donghui, Qin Ming, Huang Qing'an. Thermal simulation of a silicon gas flow sensor and its packaging. Chinese Journal of Semiconductors, 2005, 26(2): 368(in Chinese)
[6]
Dong Ziqian, Chen Jingjing, Qin Yukun, et al. Fabrication of a micromachined two-dimensional wind sensor by Au-Au wafer bonding technology. J Microelectromechan Syst, 2012, 21(2): 465 http://ieeexplore.ieee.org/abstract/document/6125959
[7]
Shen Guangping, Wu Jian, Zhang Hua, et al. Direct chip attachment (DCA) packaging of a 2-D thermal flow sensor. 8th International Conference on Electronic Packaging Technology, Shanghai, 2007: 1 http://ieeexplore.ieee.org/document/4441487/authors
[8]
Shen Guangping, Wu Jian, Zhang Hua, et al. Design of a 2D thermal wind sensor based on MEMS process. Chinese Journal of Semiconductors, 2007, 28(11): 1830(in Chinese) http://en.cnki.com.cn/Article_en/CJFDTOTAL-BDTX200711032.htm
[9]
Makinwa K A A, Huijsing J H, Hagedoorn A. A solid-state 2-D wind sensor. 6th International Workshop of SAMOS, 2006: 477 http://www.springerlink.com/index/dw0107h363577855.pdf
[10]
Ansys ICEM CFD Help Manual, 2009: 136
[11]
Ansys Release 12. 0-CFX-Pre User's Guide, 2009: 101
[12]
Matlab 2012b Optimization Toolbox User's Guide, 2012: 375
Fig. 1.  (a) Structure diagram of ceramic chip and (b) microscopic structure of ceramic chip.

Fig. 2.  Cross-section view of DCA package.

Fig. 3.  (a) Cross-section view of advanced DCA package. (b) Topview of advanced DCA package. (c) Bottom-view of advanced DCA package.

Fig. 4.  The CFD model of advanced DCA packaged chip.

Fig. 5.  The simulated velocity profiles of two DCA packaged sensors under the wind speed of 5 m/s, 10 m/s.

Fig. 6.  The simulated temperature differences curves in x axis and y axis directions.

Fig. 7.  The system block diagram of advanced DCA packaged ceramic thermal wind sensor.

Fig. 8.  The wind tunnel for calibration and measurement.

Fig. 9.  The measured output curves in x axis and y axis directions.

Fig. 10.  The errors of old DCA and advanced DCA packaged sensors.

Fig. 11.  The amplitudes of output voltages versus wind speed before fitting and after fitting.

Table 1.   The major parameters of the materials defined in the CFD model.

Table 2.   Correspondence value of MCy and yield.

[1]
Huang Jinbao, Li Bin, Tong Qinyi, et al. A fully integrated flow sensor. Chinese Journal of Semiconductors, 1989, 10(1): 55(in Chinese) https://www.ama-science.org/proceedings/details/411
[2]
Van Oudheusden B W. Silicon thermal flow sensor with a two-dimensional direction sensitivity. Measurement Science and Technology, 1990, 1(7): 565 doi: 10.1088/0957-0233/1/7/005
[3]
Huang Jinbiao, Luo Zhiqiang, Feng Yaolan, et al. Flow velocity sensor fabricated by surface micromaching technology. Chinese Journal of Semiconductors, 1993, 14(7): 450(in Chinese)
[4]
Matova S P, Makinwa Kofi A A, Huijsing J H. Compensation of packaging asymmetry in a 2-D wind sensor. IEEE Sensor J, 2003, 3(6): 761 doi: 10.1109/JSEN.2003.820324
[5]
Gao Donghui, Qin Ming, Huang Qing'an. Thermal simulation of a silicon gas flow sensor and its packaging. Chinese Journal of Semiconductors, 2005, 26(2): 368(in Chinese)
[6]
Dong Ziqian, Chen Jingjing, Qin Yukun, et al. Fabrication of a micromachined two-dimensional wind sensor by Au-Au wafer bonding technology. J Microelectromechan Syst, 2012, 21(2): 465 http://ieeexplore.ieee.org/abstract/document/6125959
[7]
Shen Guangping, Wu Jian, Zhang Hua, et al. Direct chip attachment (DCA) packaging of a 2-D thermal flow sensor. 8th International Conference on Electronic Packaging Technology, Shanghai, 2007: 1 http://ieeexplore.ieee.org/document/4441487/authors
[8]
Shen Guangping, Wu Jian, Zhang Hua, et al. Design of a 2D thermal wind sensor based on MEMS process. Chinese Journal of Semiconductors, 2007, 28(11): 1830(in Chinese) http://en.cnki.com.cn/Article_en/CJFDTOTAL-BDTX200711032.htm
[9]
Makinwa K A A, Huijsing J H, Hagedoorn A. A solid-state 2-D wind sensor. 6th International Workshop of SAMOS, 2006: 477 http://www.springerlink.com/index/dw0107h363577855.pdf
[10]
Ansys ICEM CFD Help Manual, 2009: 136
[11]
Ansys Release 12. 0-CFX-Pre User's Guide, 2009: 101
[12]
Matlab 2012b Optimization Toolbox User's Guide, 2012: 375
  • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2392 Times PDF downloads: 16 Times Cited by: 0 Times

    History

    Received: 03 December 2013 Revised: 28 February 2014 Online: Published: 01 July 2014

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Lin Zhou, Ming Qin, Shengqi Chen, Bei Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. Journal of Semiconductors, 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015 L Zhou, M Qin, S Q Chen, B Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. J. Semicond., 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015.Export: BibTex EndNote
      Citation:
      Lin Zhou, Ming Qin, Shengqi Chen, Bei Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. Journal of Semiconductors, 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015

      L Zhou, M Qin, S Q Chen, B Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. J. Semicond., 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015.
      Export: BibTex EndNote

      Ceramic thermal wind sensor based on advanced direct chip attach package

      doi: 10.1088/1674-4926/35/7/074015
      Funds:

      Project supported by the National Natural Science Foundation of China (No. 61076071)

      the National Natural Science Foundation of China 61076071

      More Information
      • Corresponding author: Qin Ming, Email:mqin@seu.edu.cn
      • Received Date: 2013-12-03
      • Revised Date: 2014-02-28
      • Published Date: 2014-07-01

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return