J. Semicond. > 2015, Volume 36 > Issue 10 > 101001, doi: 10.1088/1674-4926/36/10/101001

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Packaging investigation of optoelectronic devices

Zhike Zhang, Yu Liu, Jianguo Liu and Ninghua Zhu

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 Corresponding author: Yu Liu, yliu@semi.ac.cn

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Abstract: Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication.In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.

Key words: optoelectronic packaging, PIC, butterfly packaging



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Fig. 1.  TOSA $10 \times 10$ Gb/s PIC.

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Fig. 2.  Some conventional package types.

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Fig. 3.  10 $\times $ 10.7 Gb/s DML package module.

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Fig. 4.  4 $\times $ 25.8 Gb/s EML package module.

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Fig. 5.  8 $\times $ 12.5 Gb/s DML package module.

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    Received: 20 July 2015 Revised: Online: Published: 01 October 2015

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      Article Navigation >  Journal of Semiconductors  > 2015  >  36(10): 101001
      Zhike Zhang, Yu Liu, Jianguo Liu, Ninghua Zhu. Packaging investigation of optoelectronic devices[J]. Journal of Semiconductors, 2015, 36(10): 101001. doi: 10.1088/1674-4926/36/10/101001 Z K Zhang, Y Liu, J G Liu, N H Zhu. Packaging investigation of optoelectronic devices[J]. J. Semicond., 2015, 36(10): 101001. doi: 10.1088/1674-4926/36/10/101001.Export: BibTex EndNote
      Citation:
      Zhike Zhang, Yu Liu, Jianguo Liu, Ninghua Zhu. Packaging investigation of optoelectronic devices[J]. Journal of Semiconductors, 2015, 36(10): 101001. doi: 10.1088/1674-4926/36/10/101001

      Z K Zhang, Y Liu, J G Liu, N H Zhu. Packaging investigation of optoelectronic devices[J]. J. Semicond., 2015, 36(10): 101001. doi: 10.1088/1674-4926/36/10/101001.
      Export: BibTex EndNote
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      Packaging investigation of optoelectronic devices

      doi: 10.1088/1674-4926/36/10/101001

      • State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

      Funds:

      Project supported by the National High Technology Research and Development Program of China (Nos.2013AA014201, 2013AA014203) and the National Natural Science Foundation of China (Nos.61177080, 61335004, 61275031).

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      • Corresponding author: yliu@semi.ac.cn
      • Received Date: 2015-07-20
      • Published Date: 2015-01-25

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