SEMICONDUCTOR INTEGRATED CIRCUITS

FDTD technique based crosstalk analysis of bundled SWCNT interconnects

Yograj Singh Duksh1, Brajesh Kumar Kaushik2 and Rajendra P. Agarwal3

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 Corresponding author: Yograj Singh Duksh, E-mail: yograj.siet@gmail.com

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Abstract: The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain (FDTD) technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE.

Key words: FDTDSWCNT bundle interconnectscrosstalk delaypeak voltagecoupled transmission lines



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Fig. 1.  Structure of coupled SWCNT bundle interconnect lines.

Fig. 2.  Equivalent circuit model of SWCNT bundle interconnect for length ($l)$ greater than electron mean free path ($\lambda )$.

Fig. 3.  Capacitively coupled interconnect lines under (a) functional and (b) dynamic crosstalk scenario.

Fig. 4.  The relation between spatial and temporal discretization to achieve second order accuracy using the FDTD analysis.

Fig. 5.  Illustration of spatial discretization of bundled SWCNT interconnects line using the FDTD technique.

Fig. 6.  Transient response for victim line under functional crosstalk.

Fig. 7.  Transient response of aggressor line or victim line for in-phase switching under dynamic crosstalk.

Fig. 8.  Transient response of (a) aggressor line and (b) victim line for out-of-phase switching under dynamic crosstalk.

Fig. 9.  Crosstalk induced delay with variation in line resistance.

Fig. 10.  Propagation delay with variation in line resistance.

Fig. 11.  Peak voltages ($V_{\rm m})$ with variation of line resistance for in-phase and out-phase switching.

Fig. 12.  Peak voltage with variation in line resistance under functional crosstalk.

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Table 1.   Structural parameters of bundled SWCNT interconnect for technology node 32 nm.

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Table 2.   Crosstalk induced delay with variation in line resistance.

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Table 3.   Propagation delay with variation in line resistance.

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    Received: 19 October 2014 Revised: Online: Published: 01 May 2015

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      Yograj Singh Duksh, Brajesh Kumar Kaushik, Rajendra P. Agarwal. FDTD technique based crosstalk analysis of bundled SWCNT interconnects[J]. Journal of Semiconductors, 2015, 36(5): 055002. doi: 10.1088/1674-4926/36/5/055002 Y S Duksh, B K Kaushik, R. P. Agarwal. FDTD technique based crosstalk analysis of bundled SWCNT interconnects[J]. J. Semicond., 2015, 36(5): 055002. doi:  10.1088/1674-4926/36/5/055002.Export: BibTex EndNote
      Citation:
      Yograj Singh Duksh, Brajesh Kumar Kaushik, Rajendra P. Agarwal. FDTD technique based crosstalk analysis of bundled SWCNT interconnects[J]. Journal of Semiconductors, 2015, 36(5): 055002. doi: 10.1088/1674-4926/36/5/055002

      Y S Duksh, B K Kaushik, R. P. Agarwal. FDTD technique based crosstalk analysis of bundled SWCNT interconnects[J]. J. Semicond., 2015, 36(5): 055002. doi:  10.1088/1674-4926/36/5/055002.
      Export: BibTex EndNote

      FDTD technique based crosstalk analysis of bundled SWCNT interconnects

      doi: 10.1088/1674-4926/36/5/055002
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      • Corresponding author: E-mail: yograj.siet@gmail.com
      • Received Date: 2014-10-19
      • Accepted Date: 2014-12-29
      • Published Date: 2015-01-25

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