SEMICONDUCTOR INTEGRATED CIRCUITS

Design and test of a capacitance detection circuit based on a transimpedance amplifier

Linfeng Mu1, 2, Wendong Zhang1, 2, Changde He1, 2, Rui Zhang1, 2, Jinlong Song1, 2 and Chenyang Xue1, 2,

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 Corresponding author: Chenyang Xue, E-mail: xuechenyang@foxmail.com

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Abstract: This paper presents a transimpedance amplifier (TIA) capacitance detection circuit aimed at detecting micro-capacitance, which is caused by ultrasonic stimulation applied to the capacitive micro-machined ultrasonic transducer (CMUT). In the capacitance interface, a TIA is adopted to amplify the received signal with a center frequency of 400 kHz, and finally detect ultrasound pressure. The circuit has a strong anti-stray property and this paper also studies the calculation of compensation capacity in detail. To ensure high resolution, noise analysis is conducted. After optimization, the detected minimum ultrasound pressure is 2.1 Pa, which is two orders of magnitude higher than the former. The test results showed that the circuit was sensitive to changes in ultrasound pressure and the distance between the CMUT and stumbling block, which also successfully demonstrates the functionality of the developed TIA of the analog-front-end receiver.

Key words: TIAcapacitance detectionCMUThigh resolutiondistance test



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Fig. 1.  Principle of CMUT.

Fig. 2.  The front-end circuit of the transimpedance amplifier.

Fig. 3.  Received waveform with signal pulse. (a) Self-oscillation and trailing phenomenon without stray capacity. (b) Meliorative waveform with the function of stray capacity.

Fig. 4.  Received waveform with signal pulse. (a) Self-oscillation and trailing phenomenon without compensation capacity. (b) Meliorative waveform with the function of compensation capacity.

Fig. 5.  The effect of the compensation capacitor and feedback resistance to bandwidth. (a) Relationship between the compensation capacitor and bandwidth. (b) Relationship between feedback resistance and bandwidth.

Fig. 6.  Noise source of the transimpedance amplifier.

Fig. 7.  Physical map of CMUT and PCB.

Fig. 8.  Comparison curve between practical and theoretical values.

Fig. 9.  Spectral analysis.

Fig. 10.  System diagram of the test.

Fig. 11.  Physical map of system test for direct signal.

Fig. 12.  Comparison of received signal.

Fig. 13.  Test for pulse-echo signal. (a) Physical map of system test for pulse-echo signal. (b) Received pulse-echo signal.

Fig. 14.  Truncation chart and spectral analysis for echoes coming from the barrier. (a) Truncation chart of echoes coming from the barrier. (b) Spectral analysis of the truncation chart.

Fig. 15.  Analysis of 2D ultrasonic imaging. (a) Linear sweep of echo signal. (b) Imaging result.

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Table 1.   Experiment results.

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Table 2.   Comparison with some references.

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    Received: 13 January 2015 Revised: Online: Published: 01 July 2015

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      Linfeng Mu, Wendong Zhang, Changde He, Rui Zhang, Jinlong Song, Chenyang Xue. Design and test of a capacitance detection circuit based on a transimpedance amplifier[J]. Journal of Semiconductors, 2015, 36(7): 075007. doi: 10.1088/1674-4926/36/7/075007 L F Mu, W D Zhang, C D He, R Zhang, J L Song, C Y Xue. Design and test of a capacitance detection circuit based on a transimpedance amplifier[J]. J. Semicond., 2015, 36(7): 075007. doi: 10.1088/1674-4926/36/7/075007.Export: BibTex EndNote
      Citation:
      Linfeng Mu, Wendong Zhang, Changde He, Rui Zhang, Jinlong Song, Chenyang Xue. Design and test of a capacitance detection circuit based on a transimpedance amplifier[J]. Journal of Semiconductors, 2015, 36(7): 075007. doi: 10.1088/1674-4926/36/7/075007

      L F Mu, W D Zhang, C D He, R Zhang, J L Song, C Y Xue. Design and test of a capacitance detection circuit based on a transimpedance amplifier[J]. J. Semicond., 2015, 36(7): 075007. doi: 10.1088/1674-4926/36/7/075007.
      Export: BibTex EndNote

      Design and test of a capacitance detection circuit based on a transimpedance amplifier

      doi: 10.1088/1674-4926/36/7/075007
      Funds:

      Project supported by the National Natural Science Foundation of China (No. 61127008) and the Subsidized Program of the National High Technology Research and Development Program of China (No. 2011AA040404).

      More Information
      • Corresponding author: E-mail: xuechenyang@foxmail.com
      • Received Date: 2015-01-13
      • Accepted Date: 2015-04-28
      • Published Date: 2015-01-25

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