J. Semicond. > 2008, Volume 29 > Issue 1 > 140-143

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Fabrication and Memory Characteristics of a New Organic Thin Film Device

Guo Peng, Ji Xin, Dong Yuanwei, Lü Yinxiang and Xu Wei

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Abstract: The reversible electrical bistability of a new organic thin film device with a metal/organic/metal sandwich structure is investigated.The anode and cathode metals of the device are Ag and Al,respectively,and were fabricated by vacuum evaporation.The middle medium is 2-(hexahydropyrimidin-2-ylidene)-malononitrile (HPYM).The device,which has polar memory characteristics,can be written from a low-conductance state to a high-conductance state by a voltage pulse and can be erased by a reverse voltage.The device with a thin Al2O3 layer between base metal Al and HPYM can produce different high-conductance states through the application of different positive voltages,resulting in multilevel memory capability.The effect of different electrode combinations on conductance switching devices is studied and UV-Vis absorption spectra and Raman spectra are used to obtain information on the interfaces of the devices.

Key words: organic film devicememory deviceelectrical bistabilitymultilevel conductance

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    Received: 18 August 2015 Revised: 03 August 2007 Online: Published: 01 January 2008

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      Guo Peng, Ji Xin, Dong Yuanwei, Lü Yinxiang, Xu Wei. Fabrication and Memory Characteristics of a New Organic Thin Film Device[J]. Journal of Semiconductors, 2008, In Press. Guo P, Ji X, Dong Y W, Lü Y, Xu W. Fabrication and Memory Characteristics of a New Organic Thin Film Device[J]. J. Semicond., 2008, 29(1): 140.Export: BibTex EndNote
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      Guo Peng, Ji Xin, Dong Yuanwei, Lü Yinxiang, Xu Wei. Fabrication and Memory Characteristics of a New Organic Thin Film Device[J]. Journal of Semiconductors, 2008, In Press.

      Guo P, Ji X, Dong Y W, Lü Y, Xu W. Fabrication and Memory Characteristics of a New Organic Thin Film Device[J]. J. Semicond., 2008, 29(1): 140.
      Export: BibTex EndNote

      Fabrication and Memory Characteristics of a New Organic Thin Film Device

      • Received Date: 2015-08-18
      • Accepted Date: 2007-07-05
      • Revised Date: 2007-08-03
      • Published Date: 2007-12-26

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