Chin. J. Semicond. > 2006, Volume 27 > Issue S1 > 172-174

PAPERS

Electrical Properties of HfOxNy Gate Dielectrics

Jiang Ran and Xie Erqing

+ Author Affiliations

PDF

Abstract: The electrical properties and the conductive mechanism of HfOxNy gate dielectric films deposited by dc sputtering were studied.The results indicate that higher temperature annealing in nitride ambient is helpful to improve the electrical properties of HfOxNy gate dielectric films.And at the low electric field the I-V characteristics obeys the Ohm’s law,while at the moderate field,the conductive mechanism is according to the space charge limited current(SCLC) theory.The leakage current density is not high that indicate that HfOxNy is a promising material instead of SiO2.

Key words: HfOxNysputteringspace charge limited current(SCLC)ion hopping conduction

  • Search

    Advanced Search >>

    Article Metrics

    Article views: 3051 Times PDF downloads: 1983 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 December 2006

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Jiang Ran, Xie Erqing. Electrical Properties of HfOxNy Gate Dielectrics[J]. Journal of Semiconductors, 2006, In Press. Jiang R, Xie E Q. Electrical Properties of HfOxNy Gate Dielectrics[J]. Chin. J. Semicond., 2006, 27(13): 172.Export: BibTex EndNote
      Citation:
      Jiang Ran, Xie Erqing. Electrical Properties of HfOxNy Gate Dielectrics[J]. Journal of Semiconductors, 2006, In Press.

      Jiang R, Xie E Q. Electrical Properties of HfOxNy Gate Dielectrics[J]. Chin. J. Semicond., 2006, 27(13): 172.
      Export: BibTex EndNote

      Electrical Properties of HfOxNy Gate Dielectrics

      • Received Date: 2015-08-20

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return