Chin. J. Semicond. > 2006, Volume 27 > Issue 3 > 506-510

PAPERS

An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers

Huo Fengwei, Kang Renke, Guo Dongming, Zhao Fuling and Jin Zhuji

+ Author Affiliations

PDF

Abstract: We present an improved angle polishing method in which the end of the cover slice near the glue layer is beveled into a thin,defect-free wedge,the straight edge of which is used as the datum for measuring the depth of subsurface damage.The bevel angle can be calculated from the interference fringes formed in the wedge.The minimum depth of the subsurface damage that can be measured by this method is a few hundred nanometers.Our results show that the method is straightforward,accurate,and convenient.

Key words: silicon wafersubsurface damageangle polishingdefect etchingwedge fringes

  • Search

    Advanced Search >>

    Article Metrics

    Article views: 3307 Times PDF downloads: 3061 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 March 2006

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Huo Fengwei, Kang Renke, Guo Dongming, Zhao Fuling, Jin Zhuji. An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers[J]. Journal of Semiconductors, 2006, In Press. Huo F W, Kang R K, Guo D M, Zhao F L, Jin Z J. An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers[J]. Chin. J. Semicond., 2006, 27(3): 506.Export: BibTex EndNote
      Citation:
      Huo Fengwei, Kang Renke, Guo Dongming, Zhao Fuling, Jin Zhuji. An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers[J]. Journal of Semiconductors, 2006, In Press.

      Huo F W, Kang R K, Guo D M, Zhao F L, Jin Z J. An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers[J]. Chin. J. Semicond., 2006, 27(3): 506.
      Export: BibTex EndNote

      An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers

      • Received Date: 2015-08-20

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return