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Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia

Lin Guoqiang, Zeng Yiping, Wang Xiaoliang and Liu Hongxin

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Abstract: Au/Cr and Au/Ti/Al/Ti metal buffer layers were respectively deposited on Si(111) substrate by electron beam evaporation,and GaN was grown on these metal films by gas source molecular beam epitaxy(GSMBE).The as-deposited metal films have a flat and featureless surface and show diffraction peaks of (111)-oriented cubic Au.The GaN grown on Au/Cr/Si(111) breaks off when cooled to room temperature.GaN grown on Au/Ti/Al/Ti/Si(111) without an AlN buffer layer was amorphous.By adding an AlN buffer,GaN grown on AlN/Au/Ti/Al/Ti/Si(111) shows diffraction peaks of (0001)-oriented hexagonal GaN.After annealing at 800℃ for 20min,the metal films of Au/Ti/Al/Ti/Si(111) became amorphous and convert to a porous metal network.

Key words: GaNMBESi(111)buffer layermetal

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    Received: 18 August 2015 Revised: 22 April 2008 Online: Published: 01 October 2008

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      Lin Guoqiang, Zeng Yiping, Wang Xiaoliang, Liu Hongxin. Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia[J]. Journal of Semiconductors, 2008, In Press. Lin G Q, Zeng Y P, Wang X L, Liu H X. Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia[J]. J. Semicond., 2008, 29(10): 1998.Export: BibTex EndNote
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      Lin Guoqiang, Zeng Yiping, Wang Xiaoliang, Liu Hongxin. Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia[J]. Journal of Semiconductors, 2008, In Press.

      Lin G Q, Zeng Y P, Wang X L, Liu H X. Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia[J]. J. Semicond., 2008, 29(10): 1998.
      Export: BibTex EndNote

      Effect of a Metal Buffer Layer on GaN Grown on Si(111) by Gas Source Molecular Beam Epitaxy with Ammonia

      • Received Date: 2015-08-18
      • Accepted Date: 2008-04-22
      • Revised Date: 2008-04-22
      • Published Date: 2008-11-11

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