Chin. J. Semicond. > 2004, Volume 25 > Issue 11 > 1510-1514

CONTENTS

一种新型的集成电路金属连线温度分析解析模型

王乃龙 and 周润德

PDF

Key words: 焦耳热, 通孔效应, 边缘传热效应, 热传导

  • Search

    Advanced Search >>

    Article Metrics

    Article views: 2020 Times PDF downloads: 1322 Times Cited by: 0 Times

    History

    Received: 19 August 2015 Revised: Online: Published: 01 November 2004

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Export: BibTex EndNote
      Citation:


      Export: BibTex EndNote

      • Received Date: 2015-08-19

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return