Chin. J. Semicond. > 2001, Volume 22 > Issue 11 > 1411-1415

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电子从不同晶向Si隧穿快速热氮化SiO_2膜的电流增强及模型解释

冯文修 , 陈蒲生 , 田浦延 and 刘剑

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Key words: 电子隧穿, 快速热氮化, SiO2膜, 晶向硅

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    Received: 20 August 2015 Revised: Online: Published: 01 November 2001

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      • Received Date: 2015-08-20

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