Chin. J. Semicond. > 2006, Volume 27 > Issue S1 > 295-298

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Failure Analysis of Electronic Devices

Wang Kaijian, Li Guoliang, Zhang Jun and Wang Jing

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Abstract: In order to study the relation of crystal structure of material to performance of device and to improve performance of device,we analyze failure phenomena of the pin of electronic devices with poor weld ability by microscope and electronic probe.

Key words: electroncomponentsfailureexamines

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    Received: 20 August 2015 Revised: Online: Published: 01 December 2006

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      Wang Kaijian, Li Guoliang, Zhang Jun, Wang Jing. Failure Analysis of Electronic Devices[J]. Journal of Semiconductors, 2006, In Press. Wang K J, Li G L, Zhang J, Wang J. Failure Analysis of Electronic Devices[J]. Chin. J. Semicond., 2006, 27(13): 295.Export: BibTex EndNote
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      Wang Kaijian, Li Guoliang, Zhang Jun, Wang Jing. Failure Analysis of Electronic Devices[J]. Journal of Semiconductors, 2006, In Press.

      Wang K J, Li G L, Zhang J, Wang J. Failure Analysis of Electronic Devices[J]. Chin. J. Semicond., 2006, 27(13): 295.
      Export: BibTex EndNote

      Failure Analysis of Electronic Devices

      • Received Date: 2015-08-20

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