Chin. J. Semicond. > 2007, Volume 28 > Issue 4 > 619-624

PAPERS

Electromigration of Typical Sn-Based Solder Bump

Yu Chun, Li Peilin, Liu Junyan, Lu Hao and Chen Junmei

+ Author Affiliations

PDF

Abstract: The cross-sectional microstructures of joints with Sn37Pb, Sn3.0Ag0.5Cu, and Sn0.7Cu under electromigration were investigated. At a temperature of 60℃ and current density of 1e3A/cm2,after 187h, micro-voids form at the electron entrance of the Sn37Pb solder/Cu interface, and strip-like Pb enriches the anode side. For Sn3.0Ag0.5Cu, electromigration only results in the dissolution of the substrate Cu at the cathode side, and the thicknesses of the Cu6Sn5 and Cu3Sn intermetallic layers at the anode side are markedly bigger than the counterparts at the cathode. Likewise, the Cu6Sn5 and Cu3Sn intermetallic layers at the anode side are thicker than the counterparts at the cathode, indicating that EM also occurs in the Sn0.7Cu joint, but little Cu dissolves into the solder at the cathode side.

Key words: Sn37Pb Sn3.0Ag0.5Cu Sn0.7Cu electromigration microstructure

  • Search

    Advanced Search >>

    Article Metrics

    Article views: 3013 Times PDF downloads: 1047 Times Cited by: 0 Times

    History

    Received: 18 August 2015 Revised: 07 December 2006 Online: Published: 01 April 2007

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Yu Chun, Li Peilin, Liu Junyan, Lu Hao, Chen Junmei. Electromigration of Typical Sn-Based Solder Bump[J]. Journal of Semiconductors, 2007, In Press. Yu C, Li P L, Liu J Y, Lu H, Chen J M. Electromigration of Typical Sn-Based Solder Bump[J]. Chin. J. Semicond., 2007, 28(4): 619.Export: BibTex EndNote
      Citation:
      Yu Chun, Li Peilin, Liu Junyan, Lu Hao, Chen Junmei. Electromigration of Typical Sn-Based Solder Bump[J]. Journal of Semiconductors, 2007, In Press.

      Yu C, Li P L, Liu J Y, Lu H, Chen J M. Electromigration of Typical Sn-Based Solder Bump[J]. Chin. J. Semicond., 2007, 28(4): 619.
      Export: BibTex EndNote

      Electromigration of Typical Sn-Based Solder Bump

      • Received Date: 2015-08-18
      • Accepted Date: 2006-10-09
      • Revised Date: 2006-12-07
      • Published Date: 2007-04-09

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return