Chin. J. Semicond. > 2003, Volume 24 > Issue 1 > 90-97
|

CONTENTS

填充不流动胶的倒装焊封装中芯片的断裂问题

彩霞 , 黄卫东 , 徐步陆 and 程兆年

+ Author Affiliations

PDF

Key words: 芯片断裂, 不流动胶, 封装翘曲, 能量释放率, 应力强度因子

    • Search

    Advanced Search >>

    Article Metrics

    Article views: 2466 Times PDF downloads: 863 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 January 2003

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2003  >  24(1): 90-97
      Export: BibTex EndNote
      Citation:


      Export: BibTex EndNote
      shu

      • Received Date: 2015-08-20

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return