Chin. J. Semicond. > 2003, Volume 24 > Issue S1 > 104-106

A Method for Suspending Ultra-Thin Film Etching

Chen Shaofeng, Xia Shanhong, Song Qinglin and Zhang Jiangang

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Abstract: A method of thin film etching and the relevant Equipment are introduced. A way of fabricating large-area suspending ultra-thin films (thickness of them, 50~ 500nm, 1~ 5Mm; area of them, 3mm × 2mm, 10mm × 5mm) with metal electrodes is provided. Rate of finished products will increase by 30 per cent. The equipment has many advantages such as simple structure, small volume, light weight, low cost, easy to process, convenient to operate, and is capable of design and manufacture its form according to the need of devices.

Key words: suspending thin film etching

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    Received: 16 March 2016 Revised: Online: Published: 01 January 2003

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      Chen Shaofeng, Xia Shanhong, Song Qinglin, Zhang Jiangang. A Method for Suspending Ultra-Thin Film Etching[J]. Journal of Semiconductors, 2003, In Press. Chen S F, Xia S H, Song Q L, Zhang J G. A Method for Suspending Ultra-Thin Film Etching[J]. Chin. J. Semicond., 2003, 24(S1): 104.Export: BibTex EndNote
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      Chen Shaofeng, Xia Shanhong, Song Qinglin, Zhang Jiangang. A Method for Suspending Ultra-Thin Film Etching[J]. Journal of Semiconductors, 2003, In Press.

      Chen S F, Xia S H, Song Q L, Zhang J G. A Method for Suspending Ultra-Thin Film Etching[J]. Chin. J. Semicond., 2003, 24(S1): 104.
      Export: BibTex EndNote

      A Method for Suspending Ultra-Thin Film Etching

      • Received Date: 2016-03-16
      • Published Date: 2016-03-15

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