Citation: | Export: BibTex EndNote
|
-
References
-
Proportional views
Key words: 倒扣芯片连接, 芯下填料, 温度循环, 三维有限元模拟
Article views: 2447 Times PDF downloads: 756 Times Cited by: 0 Times
Received: 19 August 2015 Revised: Online: Published: 01 June 2002
Citation: | Export: BibTex EndNote
|
Journal of Semiconductors © 2017 All Rights Reserved 京ICP备05085259号-2