Chin. J. Semicond. > 2001, Volume 22 > Issue 5 > 548-553
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一种用于功率模块热分布特性研究的精确模型(英文)

耿莉 , 陈治明 , R Kruemmer , T Reimann and J Petzoldt

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Key words: 功率电子, IGBT模块, 热仿真, 热耦合

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    Received: 20 August 2015 Revised: Online: Published: 01 May 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(5): 548-553
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      • Received Date: 2015-08-20

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