J. Semicond. > 2008, Volume 29 > Issue 1 > 174-178

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Electromigration of Cu-Ni/Solder/Ni-Cu Structures

Zhang Jinsong, Xi Hongjia, Wu Yiping and Wu Fengshun

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Abstract: We investigated the electromigration mechanisms of Cu-Ni/solder/Ni-Cu structures.An electromigration process was observed when the applied average current density (0.4e4A/cm2) was lower than the threshold value for electromigration (1.0e4A/cm2).This was attributed to the maximum current density (5.83e4A/cm2) being much higher than the threshold value at the cathode area due to effects of current crowding.Because forced-convection heat transfer was introduced,the atoms’ thermal migration maximum was suppressed and did not disturb electromigration in the propagation stage.The electromigration force was dominant in this stage.In the quick-failure stage,atomic motion was driven by the cooperation of thermal migration and electromigration,which was generated by local temperature and the atoms thermal migration increasing rapidly and significantly.

Key words: SnCu solderNi-Cu layerelectromigrationintermetallic compound

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    Received: 18 August 2015 Revised: 30 July 2007 Online: Published: 01 January 2008

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      Zhang Jinsong, Xi Hongjia, Wu Yiping, Wu Fengshun. Electromigration of Cu-Ni/Solder/Ni-Cu Structures[J]. Journal of Semiconductors, 2008, In Press. Zhang J S, Xi H J, Wu Y P, Wu F S. Electromigration of Cu-Ni/Solder/Ni-Cu Structures[J]. J. Semicond., 2008, 29(1): 174.Export: BibTex EndNote
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      Zhang Jinsong, Xi Hongjia, Wu Yiping, Wu Fengshun. Electromigration of Cu-Ni/Solder/Ni-Cu Structures[J]. Journal of Semiconductors, 2008, In Press.

      Zhang J S, Xi H J, Wu Y P, Wu F S. Electromigration of Cu-Ni/Solder/Ni-Cu Structures[J]. J. Semicond., 2008, 29(1): 174.
      Export: BibTex EndNote

      Electromigration of Cu-Ni/Solder/Ni-Cu Structures

      • Received Date: 2015-08-18
      • Accepted Date: 2007-06-21
      • Revised Date: 2007-07-30
      • Published Date: 2007-12-26

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