Chin. J. Semicond. > 2007, Volume 28 > Issue 3 > 435-438

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Mo/Schottky Barrier Diodes on 4H-Silicon Carbide

Zhang Fasheng and Li Xinran

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Abstract: With microelectronics plane technology,RF sputtering was used to deposit Mo to form a Schottky contact and electron beam evaporation was used to deposit Ni to form an ohmic contact in high vacuum ambient,and Mo/4H-SiC Schottky-barrier diodes were made in structures containing three-FLR.High-temperature annealing for the Mo contact is found to be effective in controlling the Schottky-barrier height at 1.2~1.3eV without degradation of the n-factor and reverse characteristics.A breakdown voltage of 3kV,a specific on resistance of 9.2mΩ·cm2, and a good V2b/Ron value of 978MW/cm2 for Mo/4H-SiC Schottky-barrier diodes are obtained experimentally.

Key words: SiCMoSchottky barrier diode

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    Received: 18 August 2015 Revised: 30 September 2006 Online: Published: 01 March 2007

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      Zhang Fasheng, Li Xinran. Mo/Schottky Barrier Diodes on 4H-Silicon Carbide[J]. Journal of Semiconductors, 2007, In Press. Zhang F S, Li X R. Mo/Schottky Barrier Diodes on 4H-Silicon Carbide[J]. Chin. J. Semicond., 2007, 28(3): 435.Export: BibTex EndNote
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      Zhang Fasheng, Li Xinran. Mo/Schottky Barrier Diodes on 4H-Silicon Carbide[J]. Journal of Semiconductors, 2007, In Press.

      Zhang F S, Li X R. Mo/Schottky Barrier Diodes on 4H-Silicon Carbide[J]. Chin. J. Semicond., 2007, 28(3): 435.
      Export: BibTex EndNote

      Mo/Schottky Barrier Diodes on 4H-Silicon Carbide

      • Received Date: 2015-08-18
      • Accepted Date: 2006-07-16
      • Revised Date: 2006-09-30
      • Published Date: 2007-03-06

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