Chin. J. Semicond. > 2007, Volume 28 > Issue S1 > 504-508

Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System

Wang Libin, Liu Zhiqiang, Chen Yu, Yi Xiaoyan, Ma Long, Pan Lingfeng and Wang Liangchen

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Abstract: In order to reduce the thermal resistance of LED system,the thermal property of high power flip-chip light-emitting diode is simulated by ANSYSl0 and analyzed.The results show that the bumps,Si-submount,case and heat-sink contribute little to the thermal resistance of LED system,but the thermal resistance of chip,adhesive and heat-sink to ambient are much larger,should be much concerned in thermal design of LED system.So optimizing the design of LED chip and heatsink,choosing adhesive with high thermal conductivity can reduce the thermal resistance of LED system effectively.

Key words: finite element analysislight-emitting diodeGaNthermal simulationflip.chip

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    Received: 27 May 2016 Revised: Online: Published: 01 January 2007

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      Wang Libin, Liu Zhiqiang, Chen Yu, Yi Xiaoyan, Ma Long, Pan Lingfeng, Wang Liangchen. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Journal of Semiconductors, 2007, In Press. Wang L B, Liu Z Q, Chen Y, Yi X Y, Ma L, Pan L F, Wang L C. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Chin. J. Semicond., 2007, 28(S1): 504.Export: BibTex EndNote
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      Wang Libin, Liu Zhiqiang, Chen Yu, Yi Xiaoyan, Ma Long, Pan Lingfeng, Wang Liangchen. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Journal of Semiconductors, 2007, In Press.

      Wang L B, Liu Z Q, Chen Y, Yi X Y, Ma L, Pan L F, Wang L C. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Chin. J. Semicond., 2007, 28(S1): 504.
      Export: BibTex EndNote

      Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System

      • Received Date: 2016-05-27
      • Published Date: 2016-04-28

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