Chin. J. Semicond. > 2005, Volume 26 > Issue S1 > 45-48

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Influence of Ti Interlayer on Untrathin Ni Film Silicidation

Jiang Yulong, Ru Guoping, Qu Xinping and Li Bingzong

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Abstract: Ultra thin Ni(5nm) film and Ni(5nm)/Ti(1nm) complex film are deposited on various Si substrates by ion beam sputtering,followed by rapid thermal annealing for solid state silicidation.Four point probe method,micro-Raman scattering spectroscopy,and Auger electron spectroscopy are employed to investigate the influence of Ti interlayer on Ni/Si reaction.Experimental results show that the Ti interlayer will retard the formation of NiSi.

Key words: silicideNiSisolid-state reaction

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    Received: 19 August 2015 Revised: Online: Published: 01 December 2005

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      Jiang Yulong, Ru Guoping, Qu Xinping, Li Bingzong. Influence of Ti Interlayer on Untrathin Ni Film Silicidation[J]. Journal of Semiconductors, 2005, In Press. Jiang Y L, Ru G P, Qu X P, Li B Z. Influence of Ti Interlayer on Untrathin Ni Film Silicidation[J]. Chin. J. Semicond., 2005, 26(13): 45.Export: BibTex EndNote
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      Jiang Yulong, Ru Guoping, Qu Xinping, Li Bingzong. Influence of Ti Interlayer on Untrathin Ni Film Silicidation[J]. Journal of Semiconductors, 2005, In Press.

      Jiang Y L, Ru G P, Qu X P, Li B Z. Influence of Ti Interlayer on Untrathin Ni Film Silicidation[J]. Chin. J. Semicond., 2005, 26(13): 45.
      Export: BibTex EndNote

      Influence of Ti Interlayer on Untrathin Ni Film Silicidation

      • Received Date: 2015-08-19

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