| Citation: |
Ou Yi, Shi Shali, Li Chaobo, Jiao Binbin, Chen Dapeng. Wet Etching and Releasing of MEMS[J]. Journal of Semiconductors, 2006, In Press.
Ou Y, Shi S L, Li C B, Jiao B B, Chen D P. Wet Etching and Releasing of MEMS[J]. Chin. J. Semicond., 2006, 27(13): 347.
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Wet Etching and Releasing of MEMS
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Abstract
The FP resonant cavity as a microelectromechanical system (MEMS) device based on silicon is introduced.It is fabricated using silicon micro-machined technology.According the specifications of this kind micro-structure,analyzed some questions in the wet etching and releasing.According to the different situation,the design of the device and the technology are improved.And its feasibility is confirmed by the experiment-
Keywords:
- MEMS,
- sacrificial layer,
- wet etching,
- releasing,
- isolation groove
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References
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Proportional views
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