Chin. J. Semicond. > 2006, Volume 27 > Issue 11 > 2056-2063

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Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding

Han Lei and Zhong Jue

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Abstract: Dynamical characteristics of transducer systems are the key to the basic understanding of metal interconnection and reliable fine pitch flip-chip bonding.Systematic experimental analysis clearly shows that rich phenomena and effects such as a Duffing resonator,dynamical coupling between the transducer and bonding tool,and strange phase portraits of die movement may be explained by the nonlinear features of a real world transducer system.It is possible to explore their mechanisms and effects on bonding quality by identifying and decoding them from experimental data

Key words: thermosonic bondingPZT transducer systemnonlinear dynamics,flip-chip dieinterconnection packaging封装互连

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    Received: 18 August 2015 Revised: 15 June 2006 Online: Published: 01 November 2006

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      Han Lei, Zhong Jue. Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding[J]. Journal of Semiconductors, 2006, In Press. Han L, Zhong J. Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding[J]. Chin. J. Semicond., 2006, 27(11): 2056.Export: BibTex EndNote
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      Han Lei, Zhong Jue. Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding[J]. Journal of Semiconductors, 2006, In Press.

      Han L, Zhong J. Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding[J]. Chin. J. Semicond., 2006, 27(11): 2056.
      Export: BibTex EndNote

      Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding

      • Received Date: 2015-08-18
      • Accepted Date: 2006-03-22
      • Revised Date: 2006-06-15
      • Published Date: 2006-10-31

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