SEMICONDUCTOR DEVICES

Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures

Chen Yanhu, Shen Huajun, Liu Xinyu, Xu Hui, Li Ling and Li Huijun

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Abstract: The thermal and electro stability of multi-finger heterojunction bipolar transistors (HBTs) with different structures were analyzed and discussed simultaneously. The thermal stability of the devices with different layout structures was assessed by the DCIV test and thermal resistance calculation. Their electro stability was assessed by the calculation of the stability factor K based on the S parameter of the HBT. It is found that HBTs with higher thermal stability are prone to lower electro stability. The trade-off relationship between the two types of stability was explained and discussed by using a compact K-factor analytic formula which is derived from the small signal equivalent circuit model of HBT. The electro stability of the device with a thermal ballasting resistor was also discussed, based on the analytic formula.

Key words: heterojunction bipolar transistorthermal stabilityelectro stability

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    Received: 18 August 2015 Revised: 17 May 2010 Online: Published: 01 October 2010

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      Chen Yanhu, Shen Huajun, Liu Xinyu, Xu Hui, Li Ling, Li Huijun. Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures[J]. Journal of Semiconductors, 2010, 31(10): 104003. doi: 10.1088/1674-4926/31/10/104003 Chen Y H, Shen H J, Liu X Y, Xu H, Li L, Li H J. Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures[J]. J. Semicond., 2010, 31(10): 104003. doi:  10.1088/1674-4926/31/10/104003.Export: BibTex EndNote
      Citation:
      Chen Yanhu, Shen Huajun, Liu Xinyu, Xu Hui, Li Ling, Li Huijun. Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures[J]. Journal of Semiconductors, 2010, 31(10): 104003. doi: 10.1088/1674-4926/31/10/104003

      Chen Y H, Shen H J, Liu X Y, Xu H, Li L, Li H J. Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures[J]. J. Semicond., 2010, 31(10): 104003. doi:  10.1088/1674-4926/31/10/104003.
      Export: BibTex EndNote

      Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures

      doi: 10.1088/1674-4926/31/10/104003
      • Received Date: 2015-08-18
      • Accepted Date: 2010-04-09
      • Revised Date: 2010-05-17
      • Published Date: 2010-10-05

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