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High temperature characterization of double base epilayer 4H-SiC BJTs

Zhang Qian, Zhang Yuming, Zhang Yimen and Wang Yuehu

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Abstract: Based on the material characteristics and the operational principle of the double base epilayer BJTs, and according to the driftdiffusion and the carrier recombination theory, the common emitter current gain is calculated considering four recombination processes. Then its performance is analyzed under high temperature conditions. The results show that the emitter injection efficiency decreases due to an increase in the base ionization rate with increasing temperature. Meanwhile, the SiC/SiO2 interface states and the quality of the passivation layer will affect the surface recombination velocity, and make an obvious current gain fall-off at a high collector current.

Key words: 4H-SiC, Bipolar Junction Transistors(BJTs), current gain, carrier recombination, high temperature

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    Received: 18 August 2015 Revised: 29 June 2010 Online: Published: 01 November 2010

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      Zhang Qian, Zhang Yuming, Zhang Yimen, Wang Yuehu. High temperature characterization of double base epilayer 4H-SiC BJTs[J]. Journal of Semiconductors, 2010, 31(11): 114005. doi: 10.1088/1674-4926/31/11/114005 Zhang Q, Zhang Y M, Zhang Y M, Wang Y H. High temperature characterization of double base epilayer 4H-SiC BJTs[J]. J. Semicond., 2010, 31(11): 114005. doi:  10.1088/1674-4926/31/11/114005.Export: BibTex EndNote
      Citation:
      Zhang Qian, Zhang Yuming, Zhang Yimen, Wang Yuehu. High temperature characterization of double base epilayer 4H-SiC BJTs[J]. Journal of Semiconductors, 2010, 31(11): 114005. doi: 10.1088/1674-4926/31/11/114005

      Zhang Q, Zhang Y M, Zhang Y M, Wang Y H. High temperature characterization of double base epilayer 4H-SiC BJTs[J]. J. Semicond., 2010, 31(11): 114005. doi:  10.1088/1674-4926/31/11/114005.
      Export: BibTex EndNote

      High temperature characterization of double base epilayer 4H-SiC BJTs

      doi: 10.1088/1674-4926/31/11/114005
      • Received Date: 2015-08-18
      • Accepted Date: 2010-05-24
      • Revised Date: 2010-06-29
      • Published Date: 2010-10-31

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