SEMICONDUCTOR TECHNOLOGY

Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers

Zhao Zhigang, Guo Jinchuan, Lei Yaohu and Niu Hanben

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Abstract: We analyze the two main factors causing non-uniformity of the etched macropore array first, and then a novel photoelectrochemical etching setup for large area silicon wafers is described. This etching setup refined typical etching setups by a water cooling system and a shower-head shaped electrolyte circulator. Experimental results showed that the uniform macropore array on full 5-inch n-type silicon wafers could be fabricated by this etching setup. The morphology of the macropore array can be controlled by adjusting the corresponding etching parameters.

Key words: photoelectrochemical etchingmacropore arraylarge areanon-uniformitycurrent density

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    Received: 18 August 2015 Revised: 23 February 2010 Online: Published: 01 July 2010

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      Zhao Zhigang, Guo Jinchuan, Lei Yaohu, Niu Hanben. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. Journal of Semiconductors, 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001 Zhao Z G, Guo J C, Lei Y H, Niu H B. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. J. Semicond., 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001.Export: BibTex EndNote
      Citation:
      Zhao Zhigang, Guo Jinchuan, Lei Yaohu, Niu Hanben. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. Journal of Semiconductors, 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001

      Zhao Z G, Guo J C, Lei Y H, Niu H B. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. J. Semicond., 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001.
      Export: BibTex EndNote

      Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers

      doi: 10.1088/1674-4926/31/7/076001
      • Received Date: 2015-08-18
      • Accepted Date: 2010-01-21
      • Revised Date: 2010-02-23
      • Published Date: 2010-07-05

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