| Citation: |
Wang Dongliang, Yuan Yuan, Luo Le. Preparation of Sn–Ag–In ternary solder bumps by electroplating in sequence and reliability[J]. Journal of Semiconductors, 2011, 32(8): 083005. doi: 10.1088/1674-4926/32/8/083005
Wang D L, Yuan Y, Luo L. Preparation of Sn–Ag–In ternary solder bumps by electroplating in sequence and reliability[J]. J. Semicond., 2011, 32(8): 083005. doi: 10.1088/1674-4926/32/8/083005.
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Preparation of Sn–Ag–In ternary solder bumps by electroplating in sequence and reliability
doi: 10.1088/1674-4926/32/8/083005
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Abstract
This paper describes a technique that can obtain ternary Sn–Ag–In solder bumps with fine pitch and homogenous composition distribution. The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence. After an accurate reflow process, Sn1.8Ag9.4In solder bumps are obtained. It is found that the intermetallic compounds (IMCs) between Sn–Ag–In solder and Cu grow with the reflow time, which results in an increase in Ag concentration in the solder area. So during solidification, more Ag2In nucleates and strengthens the solder.-
Keywords:
- Sn–Ag–In solder bumps,
- electroplating,
- microstructure,
- shear strength
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References
[1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] -
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