SEMICONDUCTOR DEVICES

ESD performance of LDMOS with source-bulk layout structure optimization

Lingli Jiang, Hang Fan, Lijuan Lin and Bo Zhang

+ Author Affiliations

 Corresponding author: Jiang Lingli, jiangll.uestc@gmail.com

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Abstract: To enhance the robustness of LDMOS ESD protection devices, the influence of a source-bulk layout structure is analyzed by theoretical analysis and numerical simulation. Novel structures with varied source-bulk layout structures are fabricated and compared. As demonstrated by TLP testing, the optimized structure has an 88% larger It2 than a conventional one, and its Vt1 is reduced from 55.53 to 50.69 V.

Key words: ESDLDMOSsource-bulk layout structure



[1]
Qian Q, Sun W, Zhu J, et al. Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions. Microelectron Reliab, 2010, 50:1935 doi: 10.1016/j.microrel.2010.05.010
[2]
Mergens M P J, Wilkening W, Mettler S, et al. Analysis of lateral DMOS power devices under ESD stress conditions. Electron Devices, 2000, 47:2128 doi: 10.1109/16.877175
[3]
Moens P, Van den bosch G. Characterization of total safe operating area of lateral DMOS transistors. Device Mater Reliab, 2006, 6:349 doi: 10.1109/TDMR.2006.882212
[4]
Lai T, Ker M, Chang W, et al. High-robust ESD protection structure with embedded SCR in high-voltage CMOS process. IRPS, 2008:627 http://ieeexplore.ieee.org/document/4558959/?arnumber=4558959&sortType%3Dasc_p_Sequence%26filter%3DAND(p_IS_Number:4558854)
[5]
Imoto T, Mawatari K, Wakiyama K, et al. A novel ESD protection device structure for HV-MOS ICs. IEEE International Reliability Physics Symposium, 2009:663 http://ieeexplore.ieee.org/document/5173326/?arnumber=5173326
[6]
Lee J, Su H, Chan C, et al. The influence of the layout on the ESD performance of HV-LDMOS. ICSICT, 2010:303 http://ieeexplore.ieee.org/document/5543900/
[7]
Chen W, Ker M, Jou Y, et al. Improvement on ESD robustness of lateral DMOS in high-voltage CMOS ICs by body current injection. ISCAS, 2009:385 http://ieeexplore.ieee.org/document/5117766/
[8]
Lin L, Jiang L, Fan H, et al. Impact of parasitic resistance on the ESD robustness of high-voltage devices. Journal of Semiconductors, 2012, 33(1):59 http://www.jos.ac.cn/bdtxbcn/ch/reader/view_abstract.aspx?file_no=11051701&flag=1
[9]
Ker M, Hsu H. The impact of inner pickup on ESD robustness of multi-finger NMOS in nanoscale CMOS technology. IEEE International Reliability Physics Symposium, 2006:631 http://ieeexplore.ieee.org/document/4017238/
[10]
Murrmann H, Widmann D. Current crowding on metal contacts to planar devices. Electron Devices, 1969, 12:1022 http://ieeexplore.ieee.org/document/1475946/
[11]
Wu D, Jiang L, Fan H, et al. Analysis on the positive dependence of channel length on ESD failure current of a GGNMOS in a 5 V CMOS. Journal of Semiconductors, 2013, 34(2):024004 doi: 10.1088/1674-4926/34/2/024004
[12]
Yang Z, Liu H, Wang S. A low leakage power-rail ESD detection circuit with a modified RC network for a 90-nm CMOS process. Journal of Semiconductors, 2013, 34(4):045010 doi: 10.1088/1674-4926/34/4/045010
[13]
Voldman S H. Latchup. Chichester, England:John Wiley and Sons, Ltd, 2007:125
Fig. 1.  Cross section of the LDMOS in a 0.35 $\mu $m BCD process with a 3D diagram of the source region.

Fig. 2.  Lattice temperature distribution in the LDMOS with (a) $L_{\rm SB}$ $=$ 0 $\mu$m, (b) $L_{\rm SB}$ $=$ 4 $\mu$m.

Fig. 3.  Simulated resistance for the source-bulk structure.

Fig. 4.  Schematic layout diagrams of the source-bulk regions for the devices discussed.

Fig. 5.  TLP test results for an LDMOS with different source-bulk layout structures.

Fig. 6.  Local photos of (a) IC with Str4, (b) IC with Str1 as the ESD protection.

Table 1.   Structure summary.

Table 2.   $V_{\rm t1}$, $I_{\rm t2}$ from TLP tests and BV under DC test for Str1-Str6.

[1]
Qian Q, Sun W, Zhu J, et al. Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions. Microelectron Reliab, 2010, 50:1935 doi: 10.1016/j.microrel.2010.05.010
[2]
Mergens M P J, Wilkening W, Mettler S, et al. Analysis of lateral DMOS power devices under ESD stress conditions. Electron Devices, 2000, 47:2128 doi: 10.1109/16.877175
[3]
Moens P, Van den bosch G. Characterization of total safe operating area of lateral DMOS transistors. Device Mater Reliab, 2006, 6:349 doi: 10.1109/TDMR.2006.882212
[4]
Lai T, Ker M, Chang W, et al. High-robust ESD protection structure with embedded SCR in high-voltage CMOS process. IRPS, 2008:627 http://ieeexplore.ieee.org/document/4558959/?arnumber=4558959&sortType%3Dasc_p_Sequence%26filter%3DAND(p_IS_Number:4558854)
[5]
Imoto T, Mawatari K, Wakiyama K, et al. A novel ESD protection device structure for HV-MOS ICs. IEEE International Reliability Physics Symposium, 2009:663 http://ieeexplore.ieee.org/document/5173326/?arnumber=5173326
[6]
Lee J, Su H, Chan C, et al. The influence of the layout on the ESD performance of HV-LDMOS. ICSICT, 2010:303 http://ieeexplore.ieee.org/document/5543900/
[7]
Chen W, Ker M, Jou Y, et al. Improvement on ESD robustness of lateral DMOS in high-voltage CMOS ICs by body current injection. ISCAS, 2009:385 http://ieeexplore.ieee.org/document/5117766/
[8]
Lin L, Jiang L, Fan H, et al. Impact of parasitic resistance on the ESD robustness of high-voltage devices. Journal of Semiconductors, 2012, 33(1):59 http://www.jos.ac.cn/bdtxbcn/ch/reader/view_abstract.aspx?file_no=11051701&flag=1
[9]
Ker M, Hsu H. The impact of inner pickup on ESD robustness of multi-finger NMOS in nanoscale CMOS technology. IEEE International Reliability Physics Symposium, 2006:631 http://ieeexplore.ieee.org/document/4017238/
[10]
Murrmann H, Widmann D. Current crowding on metal contacts to planar devices. Electron Devices, 1969, 12:1022 http://ieeexplore.ieee.org/document/1475946/
[11]
Wu D, Jiang L, Fan H, et al. Analysis on the positive dependence of channel length on ESD failure current of a GGNMOS in a 5 V CMOS. Journal of Semiconductors, 2013, 34(2):024004 doi: 10.1088/1674-4926/34/2/024004
[12]
Yang Z, Liu H, Wang S. A low leakage power-rail ESD detection circuit with a modified RC network for a 90-nm CMOS process. Journal of Semiconductors, 2013, 34(4):045010 doi: 10.1088/1674-4926/34/4/045010
[13]
Voldman S H. Latchup. Chichester, England:John Wiley and Sons, Ltd, 2007:125
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    Received: 27 April 2013 Revised: 04 July 2013 Online: Published: 01 December 2013

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      Lingli Jiang, Hang Fan, Lijuan Lin, Bo Zhang. ESD performance of LDMOS with source-bulk layout structure optimization[J]. Journal of Semiconductors, 2013, 34(12): 124003. doi: 10.1088/1674-4926/34/12/124003 L L Jiang, H Fan, L J Lin, B Zhang. ESD performance of LDMOS with source-bulk layout structure optimization[J]. J. Semicond., 2013, 34(12): 124003. doi: 10.1088/1674-4926/34/12/124003.Export: BibTex EndNote
      Citation:
      Lingli Jiang, Hang Fan, Lijuan Lin, Bo Zhang. ESD performance of LDMOS with source-bulk layout structure optimization[J]. Journal of Semiconductors, 2013, 34(12): 124003. doi: 10.1088/1674-4926/34/12/124003

      L L Jiang, H Fan, L J Lin, B Zhang. ESD performance of LDMOS with source-bulk layout structure optimization[J]. J. Semicond., 2013, 34(12): 124003. doi: 10.1088/1674-4926/34/12/124003.
      Export: BibTex EndNote

      ESD performance of LDMOS with source-bulk layout structure optimization

      doi: 10.1088/1674-4926/34/12/124003
      Funds:

      the National Natural Science Foundation of China 60906038

      Project supported by the National Natural Science Foundation of China (Nos. 60906038, 61076082)

      the National Natural Science Foundation of China 61076082

      More Information
      • Corresponding author: Jiang Lingli, jiangll.uestc@gmail.com
      • Received Date: 2013-04-27
      • Revised Date: 2013-07-04
      • Published Date: 2013-12-01

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