SEMICONDUCTOR INTEGRATED CIRCUITS

A novel COB structure with integrated multifunction

Zhiguo Xie1, 2, , Cheng Li1, Binhai Yu1 and Yaohao Wang1

+ Author Affiliations

 Corresponding author: Xie Zhiguo, Email:xiezhiguo@nationstar.com

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Abstract: A novel COB (chip-on-board) structure with integrated multifunction is presented. The structure is prepared by laminating copper plate with FR4 board and then coating with a silver layer to offer high reflectivity and high conductivity. In comparison with MCPCB (aluminum) and ceramics (Al2O3) board, the substrate brings about 10% higher light extracting efficiency than aluminum board and 5% higher flux maintenance ratio than ceramics (Al2O3) board at 3000 h. With integrated multifunction, through an IC component driving high voltage serial LED chips, the COB can be directly connected to AC 110 V or 220 V power supply in lighting application.

Key words: COBintegrated multifunctionhigh reflectivityhigh conductivityAC driving



[1]
Kückmann O. High power LED arrays special requirements on packaging technology. Proc SPIE, 2006, 6134:613404 doi: 10.1117/12.646321
[2]
Hsu J T, Han W K, Chen C. Design of multi-chips LED module for lighting application. Proc SPIE, 2002, 4776:457151 http://lpi-llc.com/Papers/SPIE05_5942-13.pdf
[3]
Ha M, Graham S. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectron Reliab, 2012, 52:836 doi: 10.1016/j.microrel.2012.02.005
[4]
Kim J S, Jeon S L, Le D W. Thermal and optical properties of COB type LED module based on Al2O3 and AlN ceramic submounts. J Appl Sci, 2010, 10:3388 doi: 10.3923/jas.2010.3388.3391
[5]
Wu H H, Lin K H, Lin S T. A study on the heat dissipation of high power multi-chip COB LEDs. Microelectron J, 2012, 43:280 doi: 10.1016/j.mejo.2012.01.007
[6]
Wu H H, Lin K H, Lin S T. Efficient heat dissipation design of high-power multi-chip cob package LED modules. Advanced Materials Research, 2012, 463:1332
[7]
Wu D, Wang K, Liu S. Enhancement of light extraction efficiency of multi-chips light-emitting diode array packaging with various microstructure arrays. IEEE 61st Electronic Components and Technology Conference, 2011 http://www.osapublishing.org/abstract.cfm?&uri=oe-23-11-A640
[8]
Ao J P, Sato H, Mizobuchi T. Monolithic blue LED series arrays for high-voltage AC operation. Physica Status Solidi A, 2002, 194:376 doi: 10.1002/(ISSN)1521-396X
Fig. 1.  Basic COB architecture.

Fig. 2.  COB substrate fabricating steps.

Fig. 3.  High voltage module with serial dies.

Fig. 4.  AC direct driving LEDs by IC device.

Fig. 5.  Novel COB object.

Fig. 6.  Flux efficiency in COB packages.

Fig. 7.  Luminous maintenance rate curve.

Fig. 8.  Simulation of junction temperature left to right: ceramics (Al$_{2}$O$_{3})$, aluminum, copper.

Table 1.   COB optical electric features.

[1]
Kückmann O. High power LED arrays special requirements on packaging technology. Proc SPIE, 2006, 6134:613404 doi: 10.1117/12.646321
[2]
Hsu J T, Han W K, Chen C. Design of multi-chips LED module for lighting application. Proc SPIE, 2002, 4776:457151 http://lpi-llc.com/Papers/SPIE05_5942-13.pdf
[3]
Ha M, Graham S. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectron Reliab, 2012, 52:836 doi: 10.1016/j.microrel.2012.02.005
[4]
Kim J S, Jeon S L, Le D W. Thermal and optical properties of COB type LED module based on Al2O3 and AlN ceramic submounts. J Appl Sci, 2010, 10:3388 doi: 10.3923/jas.2010.3388.3391
[5]
Wu H H, Lin K H, Lin S T. A study on the heat dissipation of high power multi-chip COB LEDs. Microelectron J, 2012, 43:280 doi: 10.1016/j.mejo.2012.01.007
[6]
Wu H H, Lin K H, Lin S T. Efficient heat dissipation design of high-power multi-chip cob package LED modules. Advanced Materials Research, 2012, 463:1332
[7]
Wu D, Wang K, Liu S. Enhancement of light extraction efficiency of multi-chips light-emitting diode array packaging with various microstructure arrays. IEEE 61st Electronic Components and Technology Conference, 2011 http://www.osapublishing.org/abstract.cfm?&uri=oe-23-11-A640
[8]
Ao J P, Sato H, Mizobuchi T. Monolithic blue LED series arrays for high-voltage AC operation. Physica Status Solidi A, 2002, 194:376 doi: 10.1002/(ISSN)1521-396X
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    Received: 27 November 2012 Revised: Online: Published: 01 May 2013

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      Zhiguo Xie, Cheng Li, Binhai Yu, Yaohao Wang. A novel COB structure with integrated multifunction[J]. Journal of Semiconductors, 2013, 34(5): 055001. doi: 10.1088/1674-4926/34/5/055001 Z G Xie, C Li, B H Yu, Y H Wang. A novel COB structure with integrated multifunction[J]. J. Semicond., 2013, 34(5): 055001. doi: 10.1088/1674-4926/34/5/055001.Export: BibTex EndNote
      Citation:
      Zhiguo Xie, Cheng Li, Binhai Yu, Yaohao Wang. A novel COB structure with integrated multifunction[J]. Journal of Semiconductors, 2013, 34(5): 055001. doi: 10.1088/1674-4926/34/5/055001

      Z G Xie, C Li, B H Yu, Y H Wang. A novel COB structure with integrated multifunction[J]. J. Semicond., 2013, 34(5): 055001. doi: 10.1088/1674-4926/34/5/055001.
      Export: BibTex EndNote

      A novel COB structure with integrated multifunction

      doi: 10.1088/1674-4926/34/5/055001
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