Chin. J. Semicond. > 2005, Volume 26 > Issue 2 > 395-398

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Abstract: 利用乙二醇本身的分子结构和氢键在10万级的超净环境下成功进行了多层乙二醇环境下的硅/硅直接键合,在氮气保护下1100℃热处理后进行了拉力强度测试,平均键合强度达到了10Mpa,SEM观测表明,在键合界面没有发现孔洞和空隙。这为发展多层结构、多功能集成的MEMS结构器件奠定了良好的工艺基础。

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    Received: 19 August 2015 Revised: Online: Published: 01 February 2005

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      乙二醇辅助多层硅/硅直接键合[J]. Journal of Semiconductors, 2005, In Press. 乙二醇辅助多层硅/硅直接键合[J]. Chin. J. Semicond., 2005, 26(2): 395.Export: BibTex EndNote
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      乙二醇辅助多层硅/硅直接键合[J]. Journal of Semiconductors, 2005, In Press.

      乙二醇辅助多层硅/硅直接键合[J]. Chin. J. Semicond., 2005, 26(2): 395.
      Export: BibTex EndNote

      乙二醇辅助多层硅/硅直接键合

      • Received Date: 2015-08-19

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