Chin. J. Semicond. > 2007, Volume 28 > Issue S1 > 225-229

Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System

Zhang Qunshe and Chen Zhiming

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Abstract: The influences of different spaces between turns of the induction coil and different relative positions between the coil and the crucible on the temperature distribution of the growth chamber,SiC powder,growing crystal and the radial tern- perature gradients of crystal growth surfaces are investigated systematically for the large size 6H-SiC growth. All simulations results indicate that the temperature field in the growth system can be optimized by adjusting the height and spaces between turns of inductive coil,assuming that the output power and frequency,as well as inner radius of blind hole are constant.

Key words: PVT methodSiC powder temperature distributiontemperature gradient温度梯度

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    Received: 27 May 2016 Revised: Online: Published: 01 January 2007

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      Zhang Qunshe, Chen Zhiming. Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System[J]. Journal of Semiconductors, 2007, In Press. Zhang Q S, Chen Z M. Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System[J]. Chin. J. Semicond., 2007, 28(S1): 225.Export: BibTex EndNote
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      Zhang Qunshe, Chen Zhiming. Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System[J]. Journal of Semiconductors, 2007, In Press.

      Zhang Q S, Chen Z M. Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System[J]. Chin. J. Semicond., 2007, 28(S1): 225.
      Export: BibTex EndNote

      Effects of Different Heights and Spaces of a Multi-Turn Inductive Coil on Temperature Distribution in the Large-Size 6H-SiC Growth System

      • Received Date: 2016-05-27
      • Published Date: 2016-04-28

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