Chin. J. Semicond. > 2004, Volume 25 > Issue 1 > 115-119

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ULSI硅衬底的化学机械抛光

张楷亮 , 刘玉岭 , 王芳 , 李志国 and 韩党辉

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Key words: 硅衬底, 化学机械抛光(CMP), ULSI, 纳米研磨料, 动力学过程

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    Received: 19 August 2015 Revised: Online: Published: 01 January 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(1): 115-119
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      • Received Date: 2015-08-19

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