Chin. J. Semicond. > 2007, Volume 28 > Issue S1 > 130-132

Effect of the Thickness of the Strained Si on Hall Mobility

Wang Qi, Wang Ronghua, Xia Dongmei, Zheng Youdou, Han Ping, Yu Huiqiang, Mei Qin, Xie Zili, Xiu Xiangqian, Zhu Shunming, Gu Shulin, Shi Yi and Zhang Rong

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Abstract: The strained Si layer is grown on the SiC/Si substrate by a low-pressure chemical vapor deposition (LPCVD) systern.The crystal quality of the layer is characterized by X-ray diffraction and Ramanspectroscopy.X-ray diffraction and Raman spectra of the sample indicate the Si layer is strained. The SEM image of the sample indicates there is the Si/SiC/Si structure.A high Hall mobility value of 300cm2/(V·s) (300K) is obtained in the strained Si layer,which is due to the eompressive biaxial strain in this layer.

Key words: strained SiSiCCVDHall mobility

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    Received: 27 May 2016 Revised: Online: Published: 01 January 2007

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      Wang Qi, Wang Ronghua, Xia Dongmei, Zheng Youdou, Han Ping, Yu Huiqiang, Mei Qin, Xie Zili, Xiu Xiangqian, Zhu Shunming, Gu Shulin, Shi Yi, Zhang Rong. Effect of the Thickness of the Strained Si on Hall Mobility[J]. Journal of Semiconductors, 2007, In Press. Wang Q, Wang R H, Xia D M, Zheng Y D, Han P, Yu H Q, Mei Q, Xie Z L, Xiu X Q, Zhu S M, Gu S L, Shi Y, Zhang R. Effect of the Thickness of the Strained Si on Hall Mobility[J]. Chin. J. Semicond., 2007, 28(S1): 130.Export: BibTex EndNote
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      Wang Qi, Wang Ronghua, Xia Dongmei, Zheng Youdou, Han Ping, Yu Huiqiang, Mei Qin, Xie Zili, Xiu Xiangqian, Zhu Shunming, Gu Shulin, Shi Yi, Zhang Rong. Effect of the Thickness of the Strained Si on Hall Mobility[J]. Journal of Semiconductors, 2007, In Press.

      Wang Q, Wang R H, Xia D M, Zheng Y D, Han P, Yu H Q, Mei Q, Xie Z L, Xiu X Q, Zhu S M, Gu S L, Shi Y, Zhang R. Effect of the Thickness of the Strained Si on Hall Mobility[J]. Chin. J. Semicond., 2007, 28(S1): 130.
      Export: BibTex EndNote

      Effect of the Thickness of the Strained Si on Hall Mobility

      • Received Date: 2016-05-27
      • Published Date: 2016-04-28

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