Chin. J. Semicond. > 2005, Volume 26 > Issue 2 > 368-372

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Abstract: 针对硅热流量传感器的封装,给出了其一维简化理论模型,并采用有限元分析工具ANSYS/FLOTRAN,建立了该封装结构的热模型.模拟结果显示,该封装后的传感器的温度场与未封装传感器相似,证明陶瓷封装结构是可行的;同时比较了封装前后传感器性能的差异,并进一步分析了传感器的热性能和其特征尺寸的关系.该模型的建立,可以减少大量的模拟分析过程,减小计算量,研究结果将为该传感器封装的进一步优化设计提供理论参考和依据.

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    Received: 19 August 2015 Revised: Online: Published: 01 February 2005

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      硅热流量传感器封装的热模拟分析[J]. Journal of Semiconductors, 2005, In Press. 硅热流量传感器封装的热模拟分析[J]. Chin. J. Semicond., 2005, 26(2): 368.Export: BibTex EndNote
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      硅热流量传感器封装的热模拟分析[J]. Journal of Semiconductors, 2005, In Press.

      硅热流量传感器封装的热模拟分析[J]. Chin. J. Semicond., 2005, 26(2): 368.
      Export: BibTex EndNote

      硅热流量传感器封装的热模拟分析

      • Received Date: 2015-08-19

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