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Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication

Zhou Zaifa, Huang Qing'an and Li Weihua

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Abstract: Simulations of photoresist etching,aerial image,exposure,and post-bake processes are integrated to obtain a photolithography process simulation for microelectromechanical system(MEMS) and integrated circuit(IC) fabrication based on three-dimensional (3D) cellular automata(CA).The simulation results agree well with available experimental results.This indicates that the 3D dynamic CA model for the photoresist etching simulation and the 3D CA model for the post-bake simulation could be useful for the monolithic simulation of various lithography processes.This is determined to be useful for the device-sized fabrication process simulation of IC and MEMS.

Key words: cellular automataprocess simulationphotolithography simulationmodelTCAD

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    Received: 20 August 2015 Revised: Online: Published: 01 April 2006

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      Zhou Zaifa, Huang Qing'an, Li Weihua. Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication[J]. Journal of Semiconductors, 2006, In Press. Zhou Z F, Huang Q, Li W H. Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication[J]. Chin. J. Semicond., 2006, 27(4): 705.Export: BibTex EndNote
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      Zhou Zaifa, Huang Qing'an, Li Weihua. Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication[J]. Journal of Semiconductors, 2006, In Press.

      Zhou Z F, Huang Q, Li W H. Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication[J]. Chin. J. Semicond., 2006, 27(4): 705.
      Export: BibTex EndNote

      Photolithography Process Simulation for Integrated Circuitsand Microelectromechanical System Fabrication

      • Received Date: 2015-08-20

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