Chin. J. Semicond. > 2007, Volume 28 > Issue S1 > 48-51
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High Precision Finishing Process for Sapphire Substrate Surface

Niu Xinhuan, Tan Baimei, Zhao Xiaohong and Liu Yuling

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Abstract: We studied the design of experiments in order to obtain optimized chemical mechanical polishing (CMP) equipment variables and treated sapphire substrate surfaces using theCMP method on a C6382IW/YJ single side polisher. According to sapphire substrate and its product properties，we chose alkali slurry and took SiO2 sol as abrasive.Various process parameters，such as table speed，slurry flow rate，temperature and down force，were investigated from th.e viewpoint of high removal rate.Through the experiment results，we determined the optimal CMP process parameters

Key words: sapphire substrate, high precision finishing, chemical mechanical polishing

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    Received: 27 May 2016 Revised: Online: Published: 01 January 2007

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      Article Navigation >  Journal of Semiconductors  > 2007  >  28(S1): 48-51
      Niu Xinhuan, Tan Baimei, Zhao Xiaohong, Liu Yuling. High Precision Finishing Process for Sapphire Substrate Surface[J]. Journal of Semiconductors, 2007, In Press. Niu X H, Tan B M, Zhao X H, Liu Y L. High Precision Finishing Process for Sapphire Substrate Surface[J]. Chin. J. Semicond., 2007, 28(S1): 48.Export: BibTex EndNote
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      Niu Xinhuan, Tan Baimei, Zhao Xiaohong, Liu Yuling. High Precision Finishing Process for Sapphire Substrate Surface[J]. Journal of Semiconductors, 2007, In Press.

      Niu X H, Tan B M, Zhao X H, Liu Y L. High Precision Finishing Process for Sapphire Substrate Surface[J]. Chin. J. Semicond., 2007, 28(S1): 48.
      Export: BibTex EndNote
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      High Precision Finishing Process for Sapphire Substrate Surface

      • Institute of Microelectronics，College of Information and Engineering，Hebei University of Technology，Tianjin 300130，China,Institute of Microelectronics，College of Information and Engineering，Hebei University of Technology，Tianjin 300130，China,Institute of Microelectronics，College of Information and Engineering，Hebei University of Technology，Tianjin 300130，China and Institute of Microelectronics，College of Information and Engineering，Hebei University of Technology，Tianjin 300130，China

      • Received Date: 2016-05-27
      • Published Date: 2016-04-28

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