Chin. J. Semicond. > 2007, Volume 28 > Issue S1 > 175-178

Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal

Zhao Youwen, Lü Xiaohong, Dong Zhiyuan, Duan Manlong and Sun Wenrong

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Abstract: Vacancy and interstitial defects in as-grown and annealed semi.insulating(SI)InP single crystal have been studied by using electrical measurement,positron lifetime spectroscopy and X-ray diffraction technique.As.grown Fe.doped SI.InP contains vacancy which gives rise to deep level compensation defects and deteriorates electrical property of the material.Vacaney is fully suppressed in SI material that is obtained by high temperature annealing undoped InP in iron phosphide ambient.A moderate concentration of interstitial exists in the annealed material.The influence of vacancy and interstitial on electrical property and thermal stability of SI-InP have been discussed based on the experimental results.

Key words: indium phosphidesemi·insulatingvacancyinterstitial

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    Received: 27 May 2016 Revised: Online: Published: 01 January 2007

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      Zhao Youwen, Lü Xiaohong, Dong Zhiyuan, Duan Manlong, Sun Wenrong. Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal[J]. Journal of Semiconductors, 2007, In Press. Zhao Y W, L X, Dong Z Y, Duan M L, Sun W R. Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal[J]. Chin. J. Semicond., 2007, 28(S1): 175.Export: BibTex EndNote
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      Zhao Youwen, Lü Xiaohong, Dong Zhiyuan, Duan Manlong, Sun Wenrong. Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal[J]. Journal of Semiconductors, 2007, In Press.

      Zhao Y W, L X, Dong Z Y, Duan M L, Sun W R. Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal[J]. Chin. J. Semicond., 2007, 28(S1): 175.
      Export: BibTex EndNote

      Influence of Vacancy and Interstitial on Material Property of Semi-Insulating lnP Single Crystal

      • Received Date: 2016-05-27
      • Published Date: 2016-04-28

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