SEMICONDUCTOR DEVICES

Optimized design of 4H-SiC floating junction power Schottky barrier diodes

Pu Hongbin, Cao Lin, Chen Zhiming and Ren Jie

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Abstract: SiC floating junction Schottky barrier diodes were simulated with software MEDICI 4.0 and their device structures were optimized based on forward and reverse electrical characteristics. Compared with the conventional power Schottky barrier diode, the device structure is featured by a highly doped drift region and embedded floating junction region, which can ensure high breakdown voltage while keeping lower specific on-state resistance, solved the contradiction between forward voltage drop and breakdown voltage. The simulation results show that with opti-mized structure parameter, the breakdown voltage can reach 4 kV and the specific on-resistance is 8.3 mΩ·cm2.

Key words: SiC floating junction Schottky barrier diode

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    Received: 18 August 2015 Revised: 18 November 2008 Online: Published: 01 April 2009

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      Pu Hongbin, Cao Lin, Chen Zhiming, Ren Jie. Optimized design of 4H-SiC floating junction power Schottky barrier diodes[J]. Journal of Semiconductors, 2009, 30(4): 044001. doi: 10.1088/1674-4926/30/4/044001 Pu H B, Cao L, Chen Z M, Ren J. Optimized design of 4H-SiC floating junction power Schottky barrier diodes[J]. J. Semicond., 2009, 30(4): 044001. doi:  10.1088/1674-4926/30/4/044001.Export: BibTex EndNote
      Citation:
      Pu Hongbin, Cao Lin, Chen Zhiming, Ren Jie. Optimized design of 4H-SiC floating junction power Schottky barrier diodes[J]. Journal of Semiconductors, 2009, 30(4): 044001. doi: 10.1088/1674-4926/30/4/044001

      Pu H B, Cao L, Chen Z M, Ren J. Optimized design of 4H-SiC floating junction power Schottky barrier diodes[J]. J. Semicond., 2009, 30(4): 044001. doi:  10.1088/1674-4926/30/4/044001.
      Export: BibTex EndNote

      Optimized design of 4H-SiC floating junction power Schottky barrier diodes

      doi: 10.1088/1674-4926/30/4/044001
      • Received Date: 2015-08-18
      • Accepted Date: 2008-10-08
      • Revised Date: 2008-11-18
      • Published Date: 2009-04-07

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