SEMICONDUCTOR DEVICES

Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave

Xinhai Yu, Changchun Chai, Xingrong Ren, Yintang Yang, Xiaowen Xi and Yang Liu

+ Author Affiliations

 Corresponding author: Yu Xinhai, Email:xhyu@stu.xidian.edu.cn

PDF

Abstract: The temperature dependence of the latch-up effects in a CMOS inverter based on 0.5 μm technology caused by high power microwave (HPM) is studied. The malfunction and power supply current characteristics are revealed and adopted as the latch-up criteria. The thermal effect is shown and analyzed in detail. CMOS inverters operating at high ambient temperature are confirmed to be more susceptible to HPM, which is verified by experimental results from previous literature. Besides the dependence of the latch-up triggering power P on the ambient temperature T follows the power-law equation P=ATβ. Meanwhile, the ever reported latch-up delay time characteristic is interpreted to be affected by the temperature distribution. In addition, it is found that the power threshold increases with the decrease in pulse width but the degree of change with a certain pulse width is constant at different ambient temperatures. Also, the energy absorbed to cause latch-up at a certain temperature is basically sustained at a constant value.

Key words: complementary metal oxide semiconductorhigh power microwavelatch-upthermal effecttemperature dependence



[1]
Kim K. High power microwave interference effects on analog and digital circuits in IC's. PhD Dissertation, College Park, University of Maryland, 2007
[2]
Ren Z, Yin W, Shi Y, et al. Thermal accumulation effects on the transient temperature responses in LDMOSFETs under the impact of a periodic electromagnetic pulse. IEEE Trans Electron Devices, 2010, 57(1):345 doi: 10.1109/TED.2009.2034995
[3]
Kim K, Iliadis A A. Operational upsets and critical new bit errors in CMOS digital inverters due to high power pulsed electromagnetic interference. Solid-State Electron, 2010, 54(1):18 doi: 10.1016/j.sse.2009.09.006
[4]
Iliadis A A, Kyechong K. Theoretical foundation for upsets in CMOS circuits due to high-power electromagnetic interference. IEEE Trans Device Mater Reliab, 2010, 10(3):347 doi: 10.1109/TDMR.2010.2050692
[5]
Wang H, Li J, Li H, et al. Experimental study and SPICE simulation of CMOS inverters latch-up effects due to high power microwave interference. Prog Electromagn Res, 2008, 87:313 doi: 10.2528/PIER08100408
[6]
Kim K, Iliadis A A. Latch-up effects in CMOS inverters due to high power pulsed electromagnetic interference. Solid-State Electron, 2008, 52(10):1589 doi: 10.1016/j.sse.2008.06.041
[7]
Chen J, Du Z W. Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses. http://dx.doi.org/10.1016/j.microrel.2013.07.004, 2013
[8]
Chen Jie, Du Z W. Device simulation studies on latch-up effects in CMOS inverters induced by microwave pulse. Micro Electron Rel, 2013, 53(3):371 http://www.sciencedirect.com/science/article/pii/S002627141200488X
[9]
Hwang S M, Hong J H, Han S M, et al. Delay time and power supply current characteristics of CMOS inverter broken by intentional high power microwave. Proceedings of Asia-Pacific Microwave Conference, Bangkok, 2007:1 http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4554704
[10]
Chai Changchun, Ma Zhenyang, Ren Xingrong, et al. Hardening measures for bipolar transistors against microwave-induced damage. Chin Phys B, 2013, 22(6):068502 doi: 10.1088/1674-1056/22/6/068502
[11]
Kim K, Iliadis A A. Effects of microwave interference on the operational parameters of n-channel enhancement mode MOSFET devices in CMOS integrated circuits. Solid-State Electron, 2004, 48(10/11):1795 http://adsabs.harvard.edu/abs/2004SSEle..48.1795K
[12]
Integrated Systems Engineering Corp. ISE-TCAD Dessis Simulation User's Manual. Zurich, Switzerland, 2004:15.195
[13]
Arora N D, Hauser J R, Roulston D J. Electron and hole mobilities in silicon as a function of concentration and temperature. IEEE Trans Electron Devices, 1982, 29(2):292 doi: 10.1109/T-ED.1982.20698
[14]
Baliga B J, Ghandhi S K. Electrical and optical properties of tin oxide-gallium arsenide heterojunctions. Solid-State Electron, 1976, 19:739 doi: 10.1016/0038-1101(76)90152-0
[15]
Brodbeck T, Stadler W, Baumann C, et al. Triggering of transient latch-up (TLU) by system level ESD. 32nd EOS/ESD Symposium, 2010:1 http://ieeexplore.ieee.org/document/5623707/?reload=true&arnumber=5623707&contentType=Conference+Publications
[16]
Estreich D B. The physics and modeling of latch-up and CMOS integrated circuits. Stanford University, Stanford, CA, Tech. Rep. G-201-9, 1980
[17]
He Jian, Xu Xueliang, Wang Jian'an, et al. Study on temperature effects on current gain of bipolar transistor. Microelectronics, 2012, 42(2):270(in Chinese) http://en.cnki.com.cn/Article_en/CJFDTOTAL-MINI201202029.htm
[18]
Liu E K, Zhu B S, Luo J S. Semiconductor physics. 4th ed. Beijing:National Defense Industry Press, 2008:67(in Chinese)
Fig. 1.  Basic schematic of the CMOS inverter consisting of a parasitic p-n-p-n structure.

Fig. 2.  The responses of the CMOS inverter with no HPM, and with HPM at 10.8 dBm and 16.2 dBm.

Fig. 3.  Variation of the power supply current $I_{\rm dd}$ versus time in three cases.

Fig. 4.  Variation of the maximum temperature in the CMOS inverter versus time in two cases.

Fig. 5.  The current density distribution in the CMOS inverter at (a) 7.91 ns and (b) 8.42 ns.

Fig. 6.  The temperature distribution in the CMOS inverter at (a) 10 ns and (b) 100 ns. (c) The current density distribution in the CMOS inverter at 100 ns.

Fig. 7.  Variation of the latch-up triggering power and relative voltage versus temperature.

Fig. 8.  Variation of the electron mobility and P-Substrate resistance versus ambient temperature.

Fig. 9.  The variation of output voltage and power supply current $I_{\rm dd}$ under different conditions.

Fig. 10.  The temperature distribution in the CMOS inverter under different heat dissipation conditions.

Fig. 11.  Variation of average temperature and the electron mobility under two conditions.

Fig. 12.  The triggering power thresholds and absorbed energy with incremental pulse width at different ambient temperatures.

[1]
Kim K. High power microwave interference effects on analog and digital circuits in IC's. PhD Dissertation, College Park, University of Maryland, 2007
[2]
Ren Z, Yin W, Shi Y, et al. Thermal accumulation effects on the transient temperature responses in LDMOSFETs under the impact of a periodic electromagnetic pulse. IEEE Trans Electron Devices, 2010, 57(1):345 doi: 10.1109/TED.2009.2034995
[3]
Kim K, Iliadis A A. Operational upsets and critical new bit errors in CMOS digital inverters due to high power pulsed electromagnetic interference. Solid-State Electron, 2010, 54(1):18 doi: 10.1016/j.sse.2009.09.006
[4]
Iliadis A A, Kyechong K. Theoretical foundation for upsets in CMOS circuits due to high-power electromagnetic interference. IEEE Trans Device Mater Reliab, 2010, 10(3):347 doi: 10.1109/TDMR.2010.2050692
[5]
Wang H, Li J, Li H, et al. Experimental study and SPICE simulation of CMOS inverters latch-up effects due to high power microwave interference. Prog Electromagn Res, 2008, 87:313 doi: 10.2528/PIER08100408
[6]
Kim K, Iliadis A A. Latch-up effects in CMOS inverters due to high power pulsed electromagnetic interference. Solid-State Electron, 2008, 52(10):1589 doi: 10.1016/j.sse.2008.06.041
[7]
Chen J, Du Z W. Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses. http://dx.doi.org/10.1016/j.microrel.2013.07.004, 2013
[8]
Chen Jie, Du Z W. Device simulation studies on latch-up effects in CMOS inverters induced by microwave pulse. Micro Electron Rel, 2013, 53(3):371 http://www.sciencedirect.com/science/article/pii/S002627141200488X
[9]
Hwang S M, Hong J H, Han S M, et al. Delay time and power supply current characteristics of CMOS inverter broken by intentional high power microwave. Proceedings of Asia-Pacific Microwave Conference, Bangkok, 2007:1 http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4554704
[10]
Chai Changchun, Ma Zhenyang, Ren Xingrong, et al. Hardening measures for bipolar transistors against microwave-induced damage. Chin Phys B, 2013, 22(6):068502 doi: 10.1088/1674-1056/22/6/068502
[11]
Kim K, Iliadis A A. Effects of microwave interference on the operational parameters of n-channel enhancement mode MOSFET devices in CMOS integrated circuits. Solid-State Electron, 2004, 48(10/11):1795 http://adsabs.harvard.edu/abs/2004SSEle..48.1795K
[12]
Integrated Systems Engineering Corp. ISE-TCAD Dessis Simulation User's Manual. Zurich, Switzerland, 2004:15.195
[13]
Arora N D, Hauser J R, Roulston D J. Electron and hole mobilities in silicon as a function of concentration and temperature. IEEE Trans Electron Devices, 1982, 29(2):292 doi: 10.1109/T-ED.1982.20698
[14]
Baliga B J, Ghandhi S K. Electrical and optical properties of tin oxide-gallium arsenide heterojunctions. Solid-State Electron, 1976, 19:739 doi: 10.1016/0038-1101(76)90152-0
[15]
Brodbeck T, Stadler W, Baumann C, et al. Triggering of transient latch-up (TLU) by system level ESD. 32nd EOS/ESD Symposium, 2010:1 http://ieeexplore.ieee.org/document/5623707/?reload=true&arnumber=5623707&contentType=Conference+Publications
[16]
Estreich D B. The physics and modeling of latch-up and CMOS integrated circuits. Stanford University, Stanford, CA, Tech. Rep. G-201-9, 1980
[17]
He Jian, Xu Xueliang, Wang Jian'an, et al. Study on temperature effects on current gain of bipolar transistor. Microelectronics, 2012, 42(2):270(in Chinese) http://en.cnki.com.cn/Article_en/CJFDTOTAL-MINI201202029.htm
[18]
Liu E K, Zhu B S, Luo J S. Semiconductor physics. 4th ed. Beijing:National Defense Industry Press, 2008:67(in Chinese)
  • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 3416 Times PDF downloads: 31 Times Cited by: 0 Times

    History

    Received: 03 January 2014 Revised: 11 February 2014 Online: Published: 01 August 2014

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Xinhai Yu, Changchun Chai, Xingrong Ren, Yintang Yang, Xiaowen Xi, Yang Liu. Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave[J]. Journal of Semiconductors, 2014, 35(8): 084011. doi: 10.1088/1674-4926/35/8/084011 X H Yu, C C Chai, X R Ren, Y T Yang, X W Xi, Y Liu. Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave[J]. J. Semicond., 2014, 35(8): 084011. doi: 10.1088/1674-4926/35/8/084011.Export: BibTex EndNote
      Citation:
      Xinhai Yu, Changchun Chai, Xingrong Ren, Yintang Yang, Xiaowen Xi, Yang Liu. Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave[J]. Journal of Semiconductors, 2014, 35(8): 084011. doi: 10.1088/1674-4926/35/8/084011

      X H Yu, C C Chai, X R Ren, Y T Yang, X W Xi, Y Liu. Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave[J]. J. Semicond., 2014, 35(8): 084011. doi: 10.1088/1674-4926/35/8/084011.
      Export: BibTex EndNote

      Temperature dependence of latch-up effects in CMOS inverter induced by high power microwave

      doi: 10.1088/1674-4926/35/8/084011
      Funds:

      Project supported by the National Natural Science Foundation of China (No. 60776034) and the State Key Development Program for Basic Research of China (No. 2014CC339900)

      the National Natural Science Foundation of China 60776034

      the State Key Development Program for Basic Research of China 2014CC339900

      More Information
      • Corresponding author: Yu Xinhai, Email:xhyu@stu.xidian.edu.cn
      • Received Date: 2014-01-03
      • Revised Date: 2014-02-11
      • Published Date: 2014-08-01

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return