Chin. J. Semicond. > 2007, Volume 28 > Issue 10 > 1527-1531

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Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing

Jin Dongyue, Zhang Wanrong, Shen Pei, Xie Hongyun and Wang Yang

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Abstract: A multi-finger power SiGe heterojunction bipolar transistor (HBT) with non-uniform finger spacing was fabricated to improve thermal stability.Experimental results show that the peak temperature is reduced by 22K compared with that of an HBT with uniform finger spacing in the same operating conditions.The temperature profile across the device can be improved at different biases for the same HBT with non-uniform finger spacing.Because of the decrease in peak temperature and the improvement of temperature profile,the power SiGe HBT with non-uniform spacing can operate at higher bias and hence has higher power handling capability.

Key words: SiGeHBTpower

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    Received: 18 August 2015 Revised: 14 May 2007 Online: Published: 01 October 2007

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      Jin Dongyue, Zhang Wanrong, Shen Pei, Xie Hongyun, Wang Yang. Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing[J]. Journal of Semiconductors, 2007, In Press. Jin D Y, Zhang W R, Shen P, Xie H Y, Wang Y. Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing[J]. Chin. J. Semicond., 2007, 28(10): 1527.Export: BibTex EndNote
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      Jin Dongyue, Zhang Wanrong, Shen Pei, Xie Hongyun, Wang Yang. Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing[J]. Journal of Semiconductors, 2007, In Press.

      Jin D Y, Zhang W R, Shen P, Xie H Y, Wang Y. Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing[J]. Chin. J. Semicond., 2007, 28(10): 1527.
      Export: BibTex EndNote

      Multi-Finger Power SiGe HBT with Non-Uniform Finger Spacing

      • Received Date: 2015-08-18
      • Accepted Date: 2007-04-04
      • Revised Date: 2007-05-14
      • Published Date: 2007-09-26

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