J. Semicond. > 2008, Volume 29 > Issue 6 > 1180-1183

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Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation

Guo Xiaoguang, Guo Dongming, Kang Renke and Jin Zhuji

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Abstract: This paper first establishes a 3D molecular dynamics simulation model for abrasive wear.The Einstein model in solid-state physics is introduced for the conversion between the kinetic energy and temperature of the diamond atom.Then,a 3D MD program is made and executed.The results that the abrasion occurs in the early of period of the grinding.With the advance of the grinding,this kind of wear is no longer seen and the grinding comes into a steady state.In addition,the abrasive wear only can be found in the bottom of the abrasive and the surface effect has a close relation with the abrasion.The surface effect causes the shortage of configuration of atoms in the bottom of the abrasive.Thus,there are defects on the surface of the abrasive,especially at the bottom of the abrasive where the atoms have strong activity and are in an unstable condition.According to the least-energy principle,these atoms will release the energy spontaneously through plastic deformation and amorphous phase transformation,producing the wear.

Key words: nanometric machiningmolecular dynamics simulationabrasive wear

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    Received: 18 August 2015 Revised: 12 February 2008 Online: Published: 01 June 2008

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      Guo Xiaoguang, Guo Dongming, Kang Renke, Jin Zhuji. Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation[J]. Journal of Semiconductors, 2008, In Press. Guo X G, Guo D M, Kang R K, Jin Z J. Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation[J]. J. Semicond., 2008, 29(6): 1180.Export: BibTex EndNote
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      Guo Xiaoguang, Guo Dongming, Kang Renke, Jin Zhuji. Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation[J]. Journal of Semiconductors, 2008, In Press.

      Guo X G, Guo D M, Kang R K, Jin Z J. Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation[J]. J. Semicond., 2008, 29(6): 1180.
      Export: BibTex EndNote

      Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation

      • Received Date: 2015-08-18
      • Accepted Date: 2007-09-07
      • Revised Date: 2008-02-12
      • Published Date: 2008-06-05

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