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Reliability of AlGaInP light emitting diodes with an ITO current spreading layer

Gao Wei, Guo Weiling, Zhu Yanxu, Jiang Wenjing and Shen Guangdi

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Abstract: Three aging experiments were performed for AlGaInP light emitting diodes (LED) with or without indium tin oxide (ITO), which is used as a current spreading layer. It was found that the voltage of the LED with an ITO film increased at a high current stressing, while there was little change for that of the LED without the ITO. The results of the LEDs with different thicknesses of the ITO film show that the LED with a thicker ITO has a higher reliability. The main reason for the voltage increase of the LED with the ITO film might be the current crowding in the ITO film around the P-type electrode.

Key words: indium tin oxide AlGaInP light-emitting diode reliability

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    Received: 18 August 2015 Revised: 09 February 2009 Online: Published: 01 June 2009

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      Gao Wei, Guo Weiling, Zhu Yanxu, Jiang Wenjing, Shen Guangdi. Reliability of AlGaInP light emitting diodes with an ITO current spreading layer[J]. Journal of Semiconductors, 2009, 30(6): 064004. doi: 10.1088/1674-4926/30/6/064004 Gao W, Guo W L, Zhu Y X, Jiang W J, Shen G D. Reliability of AlGaInP light emitting diodes with an ITO current spreading layer[J]. J. Semicond., 2009, 30(6): 064004. doi: 10.1088/1674-4926/30/6/064004.Export: BibTex EndNote
      Citation:
      Gao Wei, Guo Weiling, Zhu Yanxu, Jiang Wenjing, Shen Guangdi. Reliability of AlGaInP light emitting diodes with an ITO current spreading layer[J]. Journal of Semiconductors, 2009, 30(6): 064004. doi: 10.1088/1674-4926/30/6/064004

      Gao W, Guo W L, Zhu Y X, Jiang W J, Shen G D. Reliability of AlGaInP light emitting diodes with an ITO current spreading layer[J]. J. Semicond., 2009, 30(6): 064004. doi: 10.1088/1674-4926/30/6/064004.
      Export: BibTex EndNote

      Reliability of AlGaInP light emitting diodes with an ITO current spreading layer

      doi: 10.1088/1674-4926/30/6/064004
      • Received Date: 2015-08-18
      • Accepted Date: 2008-12-23
      • Revised Date: 2009-02-09
      • Published Date: 2009-07-13

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