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Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation

Zi Wei, Zhou Yuqin, Liu Fengzhen and Zhu Meifang

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Abstract: Hydrogenated microcrystalline silicon (μc-Si:H) films with a high deposition rate of 1.2nm/s were prepared by hot-wire chemical vapor deposition (HWCVD).The growth-front roughening processes of the μc-Si:H films were investigated by atomic force microscopy.According to the scaling theory,the growth exponent β≈0.67,the roughness exponent α≈0.80,and the dynamic exponent 1/z=0.40 are obtained.These scaling exponents cannot be explained well by the known growth models.An attempt at Monte Carlo simulation has been made to describe the growth process of μc-Si:H film using a particle reemission model where the incident flux distribution,the type and concentration of growth radical,and sticking,reemission,shadowing mechanisms all contributed to the growing morphology.

Key words: μc-Si:Hgrowth mechanismscaling theoryMonte Carlo simulationsreemission process

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    Received: 18 August 2015 Revised: 01 April 2008 Online: Published: 01 August 2008

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      Zi Wei, Zhou Yuqin, Liu Fengzhen, Zhu Meifang. Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation[J]. Journal of Semiconductors, 2008, In Press. Zi W, Zhou Y Q, Liu F Z, Zhu M F. Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation[J]. J. Semicond., 2008, 29(8): 1465.Export: BibTex EndNote
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      Zi Wei, Zhou Yuqin, Liu Fengzhen, Zhu Meifang. Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation[J]. Journal of Semiconductors, 2008, In Press.

      Zi W, Zhou Y Q, Liu F Z, Zhu M F. Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation[J]. J. Semicond., 2008, 29(8): 1465.
      Export: BibTex EndNote

      Growth Mechanism of Microcrystalline Silicon Films by Scaling Theory and Monte Carlo Simulation

      • Received Date: 2015-08-18
      • Accepted Date: 2008-01-29
      • Revised Date: 2008-04-01
      • Published Date: 2008-08-02

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