J. Semicond. > 2019, Volume 40 > Issue 8 > 080101

EDITORIAL

Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors

Xinyu Liu1, , Dahai Wei2, and Jianhua Zhao3,

+ Author Affiliations

 Corresponding author: University of Notre Dame, Notre Dame, 46556, USA Email: Xinyu.Liu.30@nd.edu; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: dhwei@semi.ac.cn; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: jhzhao@semi.ac.cn

DOI: 10.1088/1674-4926/40/8/080101

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    Received: Revised: Online: Accepted Manuscript: 22 July 2019Published: 09 August 2019

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      Article Navigation >  Journal of Semiconductors  > 2019  >  40(8): 080101
      Xinyu Liu, Dahai Wei, Jianhua Zhao. Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors[J]. Journal of Semiconductors, 2019, 40(8): 080101. doi: 10.1088/1674-4926/40/8/080101 ****X Y Liu, D H Wei, J H Zhao, Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors[J]. J. Semicond., 2019, 40(8): 080101. doi: 10.1088/1674-4926/40/8/080101.
      Citation:
      Xinyu Liu, Dahai Wei, Jianhua Zhao. Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors[J]. Journal of Semiconductors, 2019, 40(8): 080101. doi: 10.1088/1674-4926/40/8/080101 ****
      X Y Liu, D H Wei, J H Zhao, Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors[J]. J. Semicond., 2019, 40(8): 080101. doi: 10.1088/1674-4926/40/8/080101.
      shu

      Preface to the Special Issue on Challenges and Possibilities of Magnetic Semiconductors

      DOI: 10.1088/1674-4926/40/8/080101
      • 1.

        University of Notre Dame, Notre Dame, 46556, USA

      • 2.

        Institute of Semiconductors，Chinese Academy of Sciences, Beijing,100083, China

      • 3.

        Institute of Semiconductors， Chinese Academy of Sciences, Beijing,100083, China

      More Information
      • Xinyu Liu：University of Notre Dame, Notre Dame, 46556, USA Email: Xinyu.Liu.30@nd.edu
      • Dahai Wei：Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: dhwei@semi.ac.cn
      • Jianhua Zhao：Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: jhzhao@semi.ac.cn
      • Corresponding author: University of Notre Dame, Notre Dame, 46556, USA Email: Xinyu.Liu.30@nd.edu; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: dhwei@semi.ac.cn; Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China Email: jhzhao@semi.ac.cn
      • Published Date: 2019-08-01

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